TOB Status

TOB Status

Joe IncandelaUniversity of California, Santa Barbara

For the TOB Group Tracker General Meeting

Sep. 21, 2001at CERN

Slides courtesy of: A. Affolder, C. Bloch, C. Campagnari, A. Dierlamm, E. Shabalina, A. Onnela, D. White… and others for sure.

September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 2

Module Assembly Issues

• TOB module production was slowed due to concerns about HV Bias• Long term performance instability of the conductive epoxy led us to

backside wirebonding for each sensor on all modules.

• Treatment of new TEC and TOB modules underway

• Procedure for previously completed TOB modules understood.

• Retrofit of all stored modules to start next week

• complete before rod production starts again in November

• No impact on TEC schedule is expected.

• TOB module production now back up to high rates

• Rod assembly on hold awaiting for replacement Inter-connect Cards. • Must now store a much larger than planned number of modules.

• Preparations for TEC at FNAL• UCSB R7 plate designs have been adapted to FNAL gantry

• Manufacture of parts to start soon


Production so far…

US Modules

0

500

1000

1500

2000

2500

3000

3500

Jan

-05

Jan

-05

Fe

b-0

5

Ma

r-05

Ma

r-05

Ap

r-05

Ma

y-05

Ma

y-05

Jun

-05

Jul-0

5

Au

g-0

5

Au

g-0

5

Se

p-0

5

Grade AGrade BGrade FTotal


US ARCS Testing Results

•2675 Total Tested

•2945 Grade A

•11 Grade B

•26 Grade F

•This week:

•111 of 78592 channels bad (0.14%)

UCSB

1

10

100

1000

10000

100000

1000000

10000000

Ja

n-0

5

Fe

b-0

5

Ma

r-05

Ap

r-05

Ma

y-0

5

Ju

n-0

5

Au

g-0

5

Se

p-0

5

Ch

an

ne

ls B

on

de

d

0.000%

0.020%

0.040%

0.060%

0.080%

0.100%

0.120%

Pe

rce

nta

ge

Ba

d C

ha

nn

els

Total Bad Channels

Total Channels Bonded

% Bad Channels

FNAL

1

10

100

1000

10000

100000

1000000

10000000

Ja

n-0

5

Fe

b-0

5

Ma

r-05

Ap

r-05

Ma

y-0

5

Ju

n-0

5

Au

g-0

5

Se

p-0

5

Ch

an

ne

ls B

on

de

d

0.000%

0.010%

0.020%

0.030%

0.040%

0.050%

0.060%

0.070%

0.080%

0.090%

0.100%

Pe

rce

nta

ge

Ba

d C

ha

nn

els

Total Bad Channels

Total Channels Bonded

% Bad Channels

WIEN BOX:3 modules have

failed in LT


All Modules

•Total Production:

•1248 of 1922296 channels bad (0.065%)

Good and Bad Channels

1

10

100

1000

10000

100000

1000000

10000000

Ja

n-0

5

Fe

b-0

5

Ma

r-05

Ap

r-05

Ma

y-0

5

Ju

n-0

5

Au

g-0

5

Se

p-0

5

Ch

an

ne

ls B

on

de

d

0.000%

0.010%

0.020%

0.030%

0.040%

0.050%

0.060%

0.070%

0.080%

Pe

rce

nta

ge

Ba

d C

ha

nn

els

Total Bad Channels

Total Channel Tested

% Bad Total


Completed fractions

0

200

400

600

800

1000

1200

1400

1600

1800

2000

L12p

u

L12p

d

L12su

L12sd

L34p

L56p

R5N

R5S

R6

R7

US Module Producton

Total Needed

Total Good


Backplane bias issues

•UCSB study showed evidence for decreasing conductivity with time in sensors with backside scratching and extra Ag epoxy points.

• FNAL Confirmed with lower stats

•From previous measurements the problem was understood to be the contact between the Ag epoxy and the aluminized sensor backside (and not the Ag-Au connections).

Delta Sensor Resistance (316 sensors) After LT Testing - After Assembly

1

10

100

1000

-10

-8 -6 -4 -2 0 2 4 6 8 10

ohms

Fre

quen

cy

Delta Sensor Resistance (144 sensors) July 2005 - May 2005

1

10

100

-250

-150

-50

-30

-10

-8 -6 -4 -2 0 2 4 6 8 10 30 50 150

250

ohms

Fre

que

ncy


U.S. Module Production

•For new modules we solder gold-Kapton tabs to the gold rings on the unused vias and wirebond to sensor backplanes.

• Still apply Ag epoxy to standard pads. And also use it to adhere extension pads to the backplane.

• 15 wirebonds per sensor

• Encapsulate with Sylgard 186

•Extension pads don’t affect sensor positioning during module assembly.

•UCSB has bonded to an existing pad on the frames of over 200 TEC modules and has ARCS tested these.

• No evidence of any damage.


Backside Bonding – TEC Modules

•Bonds height average 0.30 mm.

•20 modules wirebonded < 1h

•Bond pull strengths have all been over 7 grams.

•The encapsulant height can be close to the frame thickness.

• To make sure we do not go outside this envelope, we will squeegee off any excess to constrain to 0.80 mm height.


UCSB Existing Module Modifications

This Week A B F

Cumulative A B F A or B

L12pu 0 0 0 0 0 0 0.00%

L12pd 0 0 0 0 0 0 0.00%

L12su 0 0 0 0 0 0 0.00%

L12sd 0 0 0 0 0 0 0.00%

L34p 0 0 0 0 0 0 0.00%

L56p 0 0 0 2 0 0 100.00%

R5N 40 0 0 80 0 0 100.00%

R5S 20 0 0 38 0 0 100.00%

R6 19 0 0 19 0 0 100.00%

R7 24 0 0 24 0 0 100.00%

Total 103 0 0 163 0 0 100.00%

No evidence for additional noisy channels or pinholes.


Existing Module Modifications (FNAL)

•At FNAL we are planning on soldering an insulated wire from the HV point on the top side to a pad bridging the two sensors on the backside.

• Situation different due to extra silver epoxy point and Gantry assembly plate style.

• Does avoid the use of silver epoxy in the electrical connection.

• Needs to be checked that rods built with such modules do not have additional noise.

• UCSB will use this in cases where silver epoxy has completely covered the via ring.


Module Storage

•Modules are stored on aluminum plates in commercial cabinets.

• ESD shelving

• Dry air circulation

•200 modules per cabinet

•We are currently storing 2400 modules !

•We will need to add storage for >600 modules while waiting for rod assembly to restart


Rod Production

• Mostly on hold awaiting new I2C cards • Building DS rods now for CRACK • Start sustained production exercise (40 rods per site) very soon

• Internal workshop in August to converge on remaining loose ends• Minutes http://hep.ucsb.edu/cms/rod/workshopAug2005.html

• Some of the issues discussed• Agree on default long term standard scenario: 2 day, go cold 4 times• "Finalize" cuts to flag bad channels• Module grading: Same as ARCS• Rod grading - Pass if:

• Only A or B modules• ≥ 1 out of 3 non-DCU thermistors OK• I(leak) for all groups < 20 A

• XML file for DB• Went over it line-by-line


I2C Errors

• All indications are that the problem is completely solved with the new IC cards. However…

• In US test stands, we still have some occasional ones (64,68,72…)• Do not really affect testing

• Much progress done at CERN – Now believed to be completely understood and will be eliminated.

We agreed to stop I2C studies in US.

Concentrate on production readiness.

• New ICC Cards• About to have enough in hand for 20+ rods to start final rod installation

in early November!

• Focus now on preparation for high rate Rod production in US. Need:

• Shake out last kinks in production cycle (40 rod exercise).

• Definition of Digital tests.

• Some DB details to be sorted out.


Developments at CERN

• Tests performed on rods at CERN indicate that residual I2C problems are negligible.

• Another change with the IC card is the potential to change the rod grounding.

• The new design of the Interconnect-Cards allows an additional ground connection (power return to cooling pipe).

• Tests performed with Cosmic Rack were performed to understand if the additional ground connection is to be implemented or not.


Rods Acceptance at CERN

• Number of tested rods: 25

• Rod types:• SS4_H: 6 x Type 3

• SS6_L: 4 x Type 3

• SS6_H: 2 x Type 1, 2 x Type 2, 11 x Type 3

• NO rod rejected !

• Test of 3 rods takes ~ 6h


TST-TOB integration test, July 2005

The TOB fits!

… even if clearances reduced from nominal 10 mm to 2-3 mm at thermal screen connections.

Further clearance losses must not happen.



A perfect match inside the TST!



Final TIB layer 4 backward + mock-up TID inside the TOB. Inner Rails function as required, clearances ok.


Rod to Wheel insertion

Selecting the Rod.

Helium leak test of the Rod cooling pipe and Connection of the optical ribbon

Optical ribbon attached to installation fork.


Rod to Wheel assembly

Rod installation tool aligned with a “Pre-Rod”

Rod attached to the installation tool at comfortable height and orientation.

Installation tool supported from the Wheel


Alignment tube prototype

Alignment tubes supplied by Aachen.


To do

• Test insertion and pipe soldering of a Double-Sided rod

• Prepare of lab 186 (upstairs) for present integration work• He, dry air, C6F14 lines, He leak detector

• Assembly of the Cooling segment 2.6.2 with 19 FNAL “Pre-Rods”• Pipe soldering, Cabling, Functional tests (power, ctrl, read-out)

• Development and testing of work platforms, tooling, etc.

• Get ready (by end of October) to start final Rod assembly• Dismount pre-assembled Cooling segment 2.6.2,

• Production and testing of all cooling manifolds (88-2)

• Cable supports for the Wheel and for the Thermal Screen

• Prepare equipment for Wheel transport to downstairs 186

• Solve all unforeseen…


Schedule

•FIRST RODS FOR FINAL INTEGRATION AT CERN:

• 11+11 rods finished and shipped to CERN by Oct. 14

• SS6-H type 1,2,3: 1,1,15+1

• US to study ICC swap in-line with production

•US Rod production ramp and rates

• Agreed today on ramping up to 4 rods per day at each site starting in November

• With 20% contingency, the rate is 130 rods per month delivered to CERN.

Month TOB+ TOB-

Buffer or Deficit at 3/d/site

Buffer or Deficit at 4/d/site

Oct 0 20

Nov 0 60 40 70

Dec 80 0 20 50

Jan 70 0 30 60

Feb 120 70 -90 -60

Mar 100 120 -120 -90

Apr 0 100 0 30

Totals 370 370 -120 60


In summary, things are going well


Backup slides


Hybrid Testing (as of Sep. 10)

Weekly Cumulative

Pass Fail Pass Fail % Pass

L12su 0 0 38 0 0.00%

L12sd 0 0 40 0 0.00%

L12pd 60 1 226 1 0.00%

L34p+L12pu 38 0 1084 15 98.64%

L56p 0 0 1635 22 98.67%

R2N 6 0 99 2 98.02%

R2S 0 0 78 1 98.73%

R5N 7 -1 295 2 99.33%

R5S 47 -3 325 2 99.39%

R6 9 0 334 6 98.24%

R7 0 0 158 1 0.00%

Total 167 -3 4312 52 98.81%


US Module Assembly (as of 9/16)

Weekly CumulativeA B F A B F % A or B

L12pu 12 0 0 12 0 0 0.00%L12pd 57 0 0 117 0 0 0.00%L12su 17 0 0 29 1 0 0.00%L12sd 15 0 0 36 0 0 0.00%L34p 0 0 0 788 4 10 98.75%L56p 27 0 0 1349 5 11 99.19%R5N 0 0 0 144 1 2 98.64%R5S 8 0 1 122 0 2 98.39%R6 0 0 0 215 0 0 100.00%R7 0 0 0 133 0 1 0.00%Total 136 0 1 2945 11 26 99.13%

TOB TOB 45% 45%

completecomplete

Will be Will be 48% by 48% by end of end of

this weekthis week

~650 TEC ~650 TEC completecomplete

TOB TOB 45% 45%

completecomplete

Will be Will be 48% by 48% by end of end of

this weekthis week

~650 TEC ~650 TEC completecomplete

TOB Status

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