FUJITSU Component Wireless module€¦ · 12.5 pF Shunt capacitance C 0,X32k 2 pF Equivalent series...

FUJITSU Component Wireless module

Bluetooth Smart Module

MBH7BLZ01-109003 Datasheet

Rev. 0.08

DEC 15, 2014

The above Product is designed, developed and manufactured as contemplated for general

use, including without limitation, general office use, personal use, household use, and

ordinary industrial use, but is not designed, developed and manufactured as contemplated

(1)for use accompanying fatal risks or dangers that, unless extremely high safety is secured,

could lead directly to death, personal injury, severe physical damage or other loss (i.e.,

nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass

transport control, medical life support system, missile launch control in weapon system), or

(2)for use requiring extremely high reliability (i.e., submersible repeater and artificial

satellite), hereinafter referred to as "High Safety Required Use". You shall not use this

Product without securing the sufficient safety or reliability required for the High Safety

Required Use. If you wish to use this Product for High Safety Required Use, please consult

with our sales representatives in charge before such use.

Fujitsu Component Limited

All specifications are preliminary which may be changed without any prior notice

Copyright © FUJITSU COMPONENT LIMITED 2013 - 2014 - 2 -

1. Summary ........................................................................................................................................ 4

2. Features ......................................................................................................................................... 4

3. Applicable Standard ..................................................................................................................... 5

4. Block Diagram ............................................................................................................................... 5

5. Electrical Characteristics ............................................................................................................. 6

5-1. General Features ........................................................................................................................ 6

5-2. Absolute Maximum Rating .......................................................................................................... 7

5-3. Recommendable Operating Condition ........................................................................................ 7

5-3-1. Operating Temperature ........................................................................................................ 7

5-3-2. Operating Voltage (Using Internal LDO Regulator) ............................................................. 7

5-4. I/O Terminal Characteristics ........................................................................................................ 7

5-5. Memory ........................................................................................................................................ 8

5-5-1. Flash Memory ...................................................................................................................... 8

5-5-2. RAM ..................................................................................................................................... 8

5-6. Internal 32.768kHz RC Oscillator ................................................................................................ 8

5-7. External 32.768kHz Crystal Oscillator......................................................................................... 8

5-8. Power Management .................................................................................................................... 9

5-9. Current Consumption .................................................................................................................. 9

5-10. General radio characteristics ................................................................................................. 10

5-11. Transmitter Specifications ...................................................................................................... 10

5-12. Receiver sensitivity ................................................................................................................ 10

5-13. Receiver specifications .......................................................................................................... 10

6. Interface Specification ................................................................................................................ 11

6-1. Debugger Interface .................................................................................................................... 11

7. SoftDevice .................................................................................................................................... 11

8. Pin Description ............................................................................................................................ 12

8-1. Pin assignment and Pin Description ......................................................................................... 12

8-2. Pin State on Reset ..................................................................................................................... 14

8-3. Internal Circuit Diagram ............................................................................................................. 15

9. Mechanical Characteristics ....................................................................................................... 16

9-1. Appearance and Dimensions .................................................................................................... 16

9-2. Marking ...................................................................................................................................... 16


9-3. Recommended Land Pattern .................................................................................................... 17

10. Appearance specification .......................................................................................................... 17

11. Recommended Reflow Profile ................................................................................................... 18

12. Storage Conditions ..................................................................................................................... 19

13. Packing Specification in shipment ........................................................................................... 20

13-1. Carrier Tape Appearance and Dimensions ............................................................................ 20

13-2. Reel Appearance and Dimensions ........................................................................................ 21

13-3. Taping Direction and Packing Quantity ................................................................................. 21

13-4. Tape Reel Strength ................................................................................................................ 22

13-5. Bar code label ........................................................................................................................ 22

13-6. Package ................................................................................................................................. 23

14. Revision History .......................................................................................................................... 24


1. Summary

This datasheet applies to the Bluetooth® Smart Module MBH7BLZ01-1090003.

2. Features

This product is surface-mount module compliant with Bluetooth® Specification Version 4.1,

and is possible to communicate in an ISM(Industrial Scientific Medical) band.

You can develop and embed your own application code in this module by using software

development kit(SDK) and software stack provided by Nordic Semiconductor, whose RF SoC

our module based on.

The followings are the key features.

・ Bluetooth® Specification Version 4.1 (Single mode Low Energy radio) Compliant

・ Nordic Semiconductor nRF51822 based

・ All GPIO pins(GPIO_0 to GPIO_30) of nRF51822 are assigned to this module

(Possible to use them as SPI, TWI, UART and ADC)

・ Complete Bluetooth protocol stack provide by Nordic Semiconductor

・ Power Supply: 1.9~3.6V

* Please refer to the section 5-3 for details.

・ RoHS Compliant

・ Surface mount type

・ Small footprint ( 10.5mm x 9.2mm x 1.6mm )

The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and

any use of such marks by FUJITSU COMPONENT LIMITED is under license.

Other third-party brands and names are the property of their respective owners.


3. Applicable Standard

・ Bluetooth® Specification Version 4.1

QDID: 59305

・ ARIB STD-T66

Radio Act(Japan)

Certification No. 007-AB0237

*Certification has been acquired specifying antennas. If you want to get the certification using other

antennas, please contact our local sales.

* Don't rewrite the SoftDevice from Nordic Semiconductor website.

If rewrote it, the certification might become disabled by the radio law of each country.

Please contact our local sales for details.

4. Block Diagram

Matching

Component

MBH7BLZ01

Crystal

16MHz

nRF51822

VDD

GPIO

SWDCLK

SWDIO/nRESET

RF


5. Electrical Characteristics

5-1. General Features

Bluetooth® Specification Version 4.1 Compliant

Carrier Frequency: 2400MHz ～ 2483.5MHz

Modulation: GFSK

Symbol Rate: 1Mbps

Data Rate: 1Mbps

Channel: 40ch

Channel Spacing: 2MHz

Output power: +4 dBm max


5-2. Absolute Maximum Rating

Items Symbol Min Max Unit

Supply voltage (VDD) VDD -0.3 3.6 V

Supply voltage (GND) GND - 0 V

Supply voltage (I/O) VIO -0.3 VDD+0.3 V

Storage Temperature Tstg -40 +85 °C

5-3. Recommendable Operating Condition

5-3-1. Operating Temperature

Items Symbol Min Typ Max Unit

Operating Temperature Topr -25 25 +75 °C

5-3-2. Operating Voltage (Using Internal LDO Regulator)


VDD VDD 1.9 3.3 3.6 V

* Supply power to VDD pin, and VDD1.8 pin should be floating.

5-4. I/O Terminal Characteristics


Input high voltage VIH 0.7VDD - VDD V

Input low voltage VIL GND - 0.3VDD V

Output high voltage (std. drive, 0.5 mA) VOH VDD-0.3 - VDD V

Output high voltage (high-drive, 5 mA) VOH VDD-0.3 - VDD V

Output low voltage (std. drive, 0.5 mA) VOL GND - 0.3 V

Output low voltage (high-drive, 5 mA) VOH GND - 0.3 V

Pull-up resistance RPU 11 13 16 kΩ

Pull-down resistance RPD 11 13 16 kΩ


5-5. Memory

5-5-1. Flash Memory

Flash Size Page Size Number of Pages

256kByte 1024Byte 256

Items Max Unit

Endurance 20000 write/erase cycles

Retention 10 years at 40 °C

Number of times an address can be written between erase cycles

2 times

5-5-2. RAM

RAM Size Block Start address Size

16kByte Block0 0x20000000 8kByte

Block1 0x20002000 8kByte

5-6. Internal 32.768kHz RC Oscillator

Description Symbol Min. Typ. Max. Unit

Nominal frequency fNOM,RC32k 32.768 kHz

Frequency tolerance fTOL,RC32k ±2 %

Frequency tolerance (Calibration interval 4s) fTOL,CAL,RC32k ±250 ppm

Run current IRC32k 0.5 0.8 1.1 μA

Startup time tSTART,RC32k 100 ms

5-7. External 32.768kHz Crystal Oscillator

Description Symbol Min. Typ. Max. Unit

Crystal frequency fNOM,X32k 32.768 kHz

Frequency tolerance, Bluetooth low energy applications

fTOL,X32k,BLE ±250 ppm

Load capacitance CL,X32k 12.5 pF

Shunt capacitance C0,X32k 2 pF

Equivalent series resistance RS,X32k 50 80 kΩ

Drive level PD,X32k 1 μW

Input capacitance on XL1 and XL2 pads Cpin 4 pF

Run current for 32.768 kHz crystal oscillator IX32k 0.4 1 μA

Startup current for 32.768 kHz crystal oscillator

ISTART,X32k 1.3 1.8 μA

Startup time for 32.768 kHz crystal oscillator tSTART,X32k 0.3 1.8 s

Note: This product embedding 32.768kHz RC Oscillator, external 32.768kHz Crystal Oscillator is

not necessarily required.

It is possible to add external 32.768kHz Crystal Oscillator satisfying above-mentioned

specification to increase accuracy of clock, or to reduce power consumption.


5-8. Power Management

Description Symbol Min. Typ. Max. Units

Time Reset is active from VDD reaches 1.7 V with 1 μs rise time

tPOR, 1μs 0.2 2.7

ms

Time Reset is active from VDD reaches 1.7 V with 50 ms rise time

tPOR, 50 ms 6.5 29

ms

Current in SYSTEM-OFF, no RAM retention IOFF

0.4

μA

Current in SYSTEM-OFF mode 8 kB SRAM retention

IOFF, 8 k

0.6

μA

Current in SYSTEM-OFF mode 16 kB SRAM retention

IOFF, 16 k

0.8

μA

OFF to CPU execute transition current IOFF2ON

400

μA

OFF to CPU execute tOFF2ON

9.6 10.6 μs

SYSTEM-ON base current ION

2.3

μA

Current drawn by 1V2 regulator I1V2

290

μA

Startup time for 1V2 regulator t1V2

2.3

μs


90

μA

Startup time for 1V7 regulator t1V7

2 3.6 μs

* “Power Management“ are guaranteed as SoC (nRF51822).

5-9. Current Consumption

Ta＝25±2°C

Description Symbol Min. Typ. Max. Units

TX only run current @ POUT = +4 dBm ITX,+4dBm

16

mA

TX only run current @ POUT = 0 dBm ITX,0dBm

10.5

mA

TX only run current @ POUT = -4 dBm ITX,-4dBm

8

mA


7

mA


6.5

mA


6

mA


5.5

mA


5.5

mA

TX startup current (*1) ISTART,TX

7

mA

RX only run current IRX

13

mA

RX startup current (*2) ISTART,RX

8.7

mA

Run current for 16 MHz crystal oscillator IX16M

470

uA

32.768 kHz RC oscillator Run current IRC32k

0.8 1.1 uA

SYSTEM-ON base current with 16 kB RAM enabled

ION

2.6

uA

Current drawn by 1V2 regulator and 16 MHz XOSC when both are on at the same time

I1V2XO16

810

uA


105

uA

Run current at 115200 bps IUART115k

220

uA

Run current at 1200 bps IUART1k2

210

uA

Current consumption in addition to IRX RSSICURRENT

250

uA

*1) Average current consumption (at 0 dBm TX output power) for TX startup (130 μs), and when changing

mode from RX to TX (130 μs).

*2) Average current consumption for RX startup (130 μs), and when changing mode from TX to RX (130 μs).


5-10. General radio characteristics

Ta＝25±2°C

Items Condition Min Typ Max Unit

Operating frequencies 2MHz channel spacing 2400 - 2483.5 MHz

PLL programming resolution 1 MHz

Frequency deviation ±225 ±250 ±275 kHz

5-11. Transmitter Specifications

Ta＝-25°C~75°C


Output power -20 +4 dBm

Step size of RF power control 4 dB

RF power control range +20 +24 dB

20 dB bandwidth for modulated carrier 950 1100 kHz

1st Adjacent Channel Transmit Power 1MHz

-20 dBc

2nd Adjacent Channel Transmit Power 2MHz

-40 dBc

Maximum consecutive transmission time 16 ms

Carrier frequency offset and drift

|f0-fn ≦ 50kHz

(n=2,3,4…k) -50 50 kHz

|f1-f0|≦20kHz -20 20 kHz |fn-fn-5|

n=6,7,8…k≦20kHz -20 20 kHz

5-12. Receiver sensitivity

Ta＝-25°C~75°C


Maximum received signal strength < 0.1% PER 0 dBm

Receiver sensitivity

Ideal transmitter -93 dBm

Dirty transmitter -91 dBm

5-13. Receiver specifications

Ta＝25±2°C


RX selectivity

C/I co-channel - 10 21 dB

1st ACS, C/I 1 MHz - 1 15 dB

2nd ACS, C/I 2 MHz - -25 -17 dB

ACS, C/I (3+n) MHz offset [n = 0, 1, 2, . . .]

- -51 -27 dB

lmage blocking level - -30 -9 dB

Adjacent channel to image blocking level (±1 MHz)

- -31 -15 dB

RX intermodulation IMD performance, 3rd, 4th and 5th offset channel

-50 -39 - dBm


6. Interface Specification

6-1. Debugger Interface

Serial wire Debug (SWD) interface is composed of two lines; SWDCLK pin and SWDIO pin.

RESET is a pin provided as a SWDIO functions.

RESET pin is used as SWDIO in debugger interface mode, and the reset function is disabled

as far as it is in the mode.

7. SoftDevice

This product permits use of the following Softdevice.

・s110_nrf51822_7.0.0_softdevice.hex


8. Pin Description

8-1. Pin assignment and Pin Description

<TOP View>

MBH7BLZ01-109003 Internal connection with

nRF51822 I/O Description /

External Connection

No Name No Name 1 GND - VSS - Ground

2 VDD1.8 29 DEC2 - Should be floating

3 GND - VSS - Ground

4 GPIO_17 25 P0.17 I/O General purpose I/O pin









13 GPIO_27 46 P0.27/AIN1/XL1 I/O General purpose I/O pin

Connection for 32.768 kHz crystal oscillator or external 32.768 kHz crystal reference.

14 GPIO_26 45 P0.26/AIN0/XL2 I/O General purpose I/O pin

Connection for 32.768 kHz crystal oscillator.






20 GPIO_6 10 P0.06/AIN7/AREF1 I/O General purpose I/O pin

21 GPIO_5 9 P0.05/AIN6 I/O General purpose I/O pin

22 GPIO_4 8 P0.04/AIN5 I/O General purpose I/O pin

23 GPIO_3 (U_RX) 7 P0.03/AIN4 I/O General purpose I/O pin

24 GPIO_2 (U_CTS) 6 P0.02/AIN3 I/O General purpose I/O pin

25 GPIO_1 (U_TX) 5 P0.01/AIN2 I/O General purpose I/O pin

26 GPIO_0 (U_RTS) 4 P0.00/AREF0 I/O General purpose I/O pin


28 VDD 1,12 VDD - Power supply



MBH7BLZ01-109003 Internal connection with

nRF51822 I/O Description /

External Connection

No Name No Name 30 GPIO_25 44 P0.25 I/O General purpose I/O pin









39 SWDIO/nRESET 23 SWDIO/nRESET I System reset. (Input must be low for > 0.2μs.)

Also HW debug and flash programming

40 SWDCLK 24 SWDCLK I HW debug and flash programming











51 RF 31,32 ANT1/ANT2 RF I/O RF Input/Output







8-2. Pin State on Reset

No Name State

4 GPIO_17 Input with disconnect input buffer


















23 GPIO_3 (U_RX) Input with disconnect input buffer

24 GPIO_2 (U_CTS) Input with disconnect input buffer

25 GPIO_1 (U_TX) Input with disconnect input buffer

26 GPIO_0 (U_RTS) Input with disconnect input buffer










39 SWDIO/nRESET Pull-up

40 SWDCLK Pull-down


8-3. Internal Circuit Diagram


9. Mechanical Characteristics

9-1. Appearance and Dimensions

Unit: mm

9-2. Marking

Product code: BLZ01

Identification number

Lot number: 4 X 00

Serial number: 00 ~

Month: 1 ~ 9, X, Y, Z

Year: The last digit of year

Revision number: AA ~

Logo mark

Example


9-3. Recommended Land Pattern

Following land pattern is recommended for your board design. However, you may have to

modify it according to your soldering conditions. In such case, please peform evaluation

sufficiently.

Unit: mm

10. Appearance specification

Item Contents Criterion

Shield Case Scratch No illegible character by scratch.

Discoloration No illegible character by discoloration.

PAD (Gold-plated)

Foreign substance adhesion No foreign substance.

Solder adhesion 25% or less of each Pad area.

Marking Marking specification Identical to the marking written in approval specifications for each customer.

Readability Legible.


11. Recommended Reflow Profile

Following profile is recommended for your reflow soldering. However, this profile may vary

according to the density of components, package types of components, a solder material, or

size of your printed circuit board, etc. Please perform evaluation sufficiently

Heating Preheat Soldering Cooling

50

D3

D2

D1T1 T2

Time (Sec)

Temp.

250

200

150

100

(degC)

*Note: Reflow soldering is recommended two times maximum.

If your soldering conditions are different from our recommendation, please contact our

local sales.

No Item Temperature (°C) Time (sec)

1 Pre-heat D1: 140 to D2: 200 T1: 60 to 120

2 Soldering D2: >= 200 T2: 80 max

3 Peak-Temp. D3: 250°C max


12. Storage Conditions

Moisture Sensitivity Level: IPC/JEDEC Standard J-STD-020D Level 3

Handling of unopened moisture proof bag:

It is recommended that the modules is stored at 30°C and < 60% RH, and is used within 6

months from the delivery date.

Handling of opened moisture proof bag:

The modules should be stored at 30°C and < 60% RH, and be used within 7 days after

opening the bag. If it exceeds 7 days after opening, perform the baking process (at 125°C,

24 hours) before mounting.

Do not store this modules in the environments exposed to shock or vibration. It may result

in damage, malfunction, or deterioration of quality.

D o not throw or drop cartons containing the modules during transportation. It may result

in damage, malfunction, or deterioration of quality.

Keep the modules in original packing condition until just before use.

Store the modules at recommended storage condition. When deviated from the condition,

check the appearance and function of the modules prior to use.


13. Packing Specification in shipment

13-1. Carrier Tape Appearance and Dimensions

A B W F E P0 P1 P2 T

Dimensions 9.5 11.2 24.0 11.5 1.75 4.0 12.0 2.0 2.0

Tolerance +/-0.1 +/-0.1 +/-0.3 +/-0.1 +/-0.1 +/-0.1 +/-0.1 +/-0.1 +/-0.1

Unit: mm


13-2. Reel Appearance and Dimensions

0.2

0.4

0.6

0.8 ６ＰＳ06 A B D C

W1

W2

A B C D W1 W2

Dimensions 330.0 80.0 130 21.0 25.4 29.4

Tolerance +/-2.0 +/-1.0 +/-0.2 +/-0.8 +/-1.0 +/-1.0

Unit : mm

13-3. Taping Direction and Packing Quantity


13-4. Tape Reel Strength

13-5. Bar code label

MSL3

Pb-free

RoHS


13-6. Package

cardboardcardboardPET/Al/PE 3Layer bagPaperPolystyrene+CarbonPolyesterPolystyrene+Styrenebutadiene

Outer boxInner boxMoisture proof bagHumidity IndicatorReel

Carrier tapeCover tape


14. Revision History

Revision Contents change Date

Rev. 0.01 Created first edition. JUN 14, 2013

Rev. 0.02 Section 5 was revised. Section 8-2 was revised.

AUG 23, 2013

Rev. 0.03 Changed the description of high safety notice. SEP 30, 2013

Rev. 0.04 Section 3, 5 and 12-6 was revised. Added section 9.

FEB 10, 2014

Rev. 0.05 Section 5 was revised. MAR 31, 2014

Rev. 0.06 Section 2, 5-3 and 7-1 was revised. JUL 9, 2014

Rev. 0.07 Section 5-6, 5-7 and 7-1 was revised. AUG 22, 2014

Rev. 0.08

Changed the version of Bluetooth® Specification. Section 5-6 and 5-7: Added 32.768kHz oscillator specifications. Section 7: Added Revision of Softdevice. Section 3, 8-1 and 9-2 was revised.

DEC 15, 2014

FUJITSU Component Wireless module€¦ · 12.5 pF Shunt capacitance C 0,X32k 2 pF Equivalent series...

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