07-LTE Overview UPC 20130712_Cesar Huamani
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HUAWEI TECHNOLOGIES CO., LTD.
LTE OVERVIEW
July 12th. 2013M.Sc. Cesar Huamani HuarcayaWireless solution Department
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HISILICON SEMICONDUCTOR
HUAWEI TECHNOLOGIES CO., LTD. Page 2
Agenda
LTE Long term Evolutio
LTE industry introduction
LTE standard
Key Technology for LTE
Single RAN LTE
Driving LTE commercializat
Introduction to LTE-A
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HISILICON SEMICONDUCTOR
HUAWEI TECHNOLOGIES CO., LTD. Page 3
LTE Introduction
What is LTE
LTE (Long Term Evolution) is known as the evolution of Radio Access
technology conducted by 3GPP.
The radio access network would evolve to E-UTRAN (Evolved
UTRAN), accompanied by the core network evolution to EPC
(Evolved Packet Core) combined as EPS
LTE characteristics
Flexible bandwidth configuration
Peak date rate (within 20MHz bandwidth): 150Mbps for downlinkand 50Mbps for uplink
Time delay:
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HISILICON SEMICONDUCTOR
HUAWEI TECHNOLOGIES CO., LTD. Page 4
Why LTE ?LTE i
Internet
Device
New resource and faster tech to
offload UMTS traffic pressure
Network
Smart d
tr
Multimedia & Gaming
Social communication
E-business
Searching, email, location
Mobile Advertising
UMTS/HSPA
High Speed Cloud
- LTE
Low Speed Cloud-WiFi
From Phone to Smart Device
From People to Machine
From Kbps to Gpbs
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 5
LTE Blooming in Global Market
424 operators investing in LTE in 126 countries
371 operator commitments in 116 countries.
GSA forecasts 175 commercial LTE networks in
70 countries at May. 2013.
LTE device enable
ecosystemGlobal LTE Deployment Map
GSA: May . 10, 2013
LTE i
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 6
Agenda
LTE Long term Evolutio
LTE industry introduction
LTE standard
Key Technology for LTE
Single RAN LTE
Driving LTE commercializat
Introduction to LTE-A
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 7Page 7
3GPP ReleasesGPRS
171.2Kbit/s
Phase 2 Release 97
GSM
9.6Kbit/s
Phase 1EDGE
473.6 Kbit/s
Release 99
HSDPA
14.4 Mbit/s
Release 5
UMTS
2 Mbit/s
Release 99
Release 6
HSUPA
5.76 Mbit/sLTE
150 Mbit/s
Release 8
Release 7/8
HSDPA+
28.8 Mbit/s
42Mbit/s
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 9
2.6GHz 2.1GHz DD800 DD700 A1.8GHz 1.5GHz
Japan USA
UzbekistanArmenia
Norway Sweden
Finland Estonia
Demark
SwedenGermany
Belgium SwedenNorwaySerbiaDemarkHungary
Germany
Poland
Austria
BahrainSaudi Arabia
USA
JapanHongkong
Germany
Germany
Austria
USA
Hong kong
Demark
Russia
Finland
SwedenDemark
Germany
Germany
USA(L-BAND)
Latvia
Hong kong
Singapore
HongKong
Australia
Japan
(BAND 9)
C
LTE Global Landscape
Germany
Colombia
http://images.google.cn/imgres?imgurl=http://folk.uio.no/h1730g17/nyprosjekt/bilder/telenor.jpg&imgrefurl=http://folk.uio.no/h1730g17/nyprosjekt/sentraleaktorer.html&usg=__NyeBltGmxugNYUuFHrERH-5pnd8=&h=290&w=650&sz=88&hl=zh-CN&start=2&tbnid=AqryR8ONxhr0eM:&tbnh=61&tbnw=137&prev=/images?q=telenor&gbv=2&hl=zh-CN&biw=1259&newwindow=1 -
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 10
Agenda
LTE Long term Evolutio
LTE industry introduction
LTE standard
Key Technology for LTE
Single RAN LTE
Driving LTE commercializat
Introduction to LTE-A
L
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 11
Key LTE Technologies
Sub-carriers
Sub-frame
Frequency
Time
Time frequencyresource for User 1
Time frequencyresource for User 2
Time frequencyresource for User 3
System Bandwidth
Single CarrierSub-frame
Frequency
Time
Time frequencyresource for User 1
Time frequencyresource for User 2
Time frequencyresource for User 3
System Bandwidth
DL OFDMA
UL SC-FDMA
Supporting
High Performance
Scalable BWFlat
Architecture
MIMO Chan
Data Streaming
H.O.M
MIMO
eNB
MME / S-GW MME / S-GW
eNB
eNB
S1
S1
S1
S1
X2
X2X2
E-UTRAN
L
L
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 12
Multiple Access Techniques LTE uses:DL: OFDMAUL: SC-FDMA
L
HA
D0.5
1.51.3
2.0
DL* 2.0UL**
A
UL*
R8 LTE
DLUL
R8 HSPA+
LTE Spectrum Efficiency Incre
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 14
Agenda
LTE Long term Evolutio
LTE industry introduction
LTE standard
Key Technology for LTE
Single RAN LTE
Driving LTE commercializat
Introduction to LTE-A
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 15
Huaweis Understanding of LTE Deployment
LTE
Deployment
Capacity
UserExperience
OperationEfficiency
Seamless GUL Interworking Enhanced voice
E2E QoS SingleOSS
SingleSON
Visualization
Portfolio RF
modules
BBU
Cabinet
Small cells
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 16
Software Defined Equipment for Multi-mode Converg
Industrys 1st4 mode-in-one
BBU
Reduce spare parts by 60%
4Gbps throughput capability
Co-UMPT(13Q2) Co
UMPT
Software Defined BBU
UMPT
WBBP LBBP
G U L G
1.5Gbps UL+DL throughput
10,800 RRC-connected
users
18 LTE Cells
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 17
Agenda
LTE Long term Evolutio
LTE industry introduction
LTE standard
Key Technology for LTE
Single RAN LTE
Driving LTE commercializat Introduction to LTE-A
Driv
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 18
Leading 3GPP contributin LTE Core Specification since
Serving 89 key rolesIn international standards orga
Huawei Leading Contributions to LTE Standa
ABI Research: Huaweiis the No.1 contributor
260+ approved contributions since 2010
Leading LTE-A standardization: MIMO, MBMS,
CoMP, AAS.
Relative Positions of Leading Contributors to
3GPP LTE RAN Standards
2005-2008 2009 2010 2011
HuaweiHuawei 1
2
5
3
6
4
2
3
6
4
5
4
3
2
5
7
2
5
3
6
4
Ericsson
Alcatel Lucent
Qualcomm
Samsung
1
Nokia & NSN 1
1
3GPP
IEEE
Wirelessworld
research
Sour ce: ABI Research 3Q2011
0
50
100
150
200
250
300 265
210193
181
Huawei ALU Ericsson Nokia
Driv
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 19
LTE market success relies on a clear alignment with the busines
and on strong technical, financial and organizational foundation
Business Strategy
Services Devices Pricing BrandingandPromotion
Marketing Strategy and Segmentation
Network Organisation Business M
Compan
y Goals
Target
Segments and
Positioning
Go-To-Market
Foundations
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 20
Agenda
LTE Long term Evolutio
LTE industry introduction
LTE standard
Key Technology for LTE
Single RAN LTE
Driving LTE commercializatIntroduction to LTE-A
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 21
Introduction to LTE-A
In LTE-Advanced focus is on higher capacity:
Increased peak data rate, DL 3 Gbps, UL 1.5 Gbps
Higher spectral efficiency, from a maximum of 16bps/Hz in R8 to 30
bps/Hz in R10
Increased number of simultaneously active subscribers
Improved performance at cell edges, e.g. for DL 2x2 MIMO at least
2.40 bps/Hz/cell.
Carrier Aggre
The driving force to further develop LTE towards LTEAdvanced, LTE R-10 is to provide higher bitrates i
way, and at the same time completely fulfil the requirements set by ITU for IMT Advanced, also referre
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 22
Benefits:
Improved Cell Edge User SINR
Reduced inter-cell-interference
Downlink CoMP
Intra-eNB CoMP Inter-eNB CoMP
Features
Uplink
CoMP
Homogeneous network with
Homogeneous network with
Central BB
IM
in
NU
3GPP LTE-Advanced CoMP Introduction
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 23
Relay Type 1 (3GPP R10):
Own Cell-ID information (viewed as a classic eNodeB from the netw
view)
Own synchronization and RS information Relay Type 2:
Share Cell-ID with Donor eNodeB (no new cell to manage from netwo
As a consequence the UE is not able to differentiate Donor and Relay
to transmit signaling/control information via Donor eNodeB and data
The performance improvement and complexity is under evaluation b
Relay Architecture in 3GPP LTE-A (Small Cells Backha
LTE-Un Backhaul link
(Donor)
(EPC)
Mobilebackhaul
e.g. LTE-Advanced Relay
(LTE-Un interface) uses part
of Donor eNodeB radio
resources for backhaulSource: LTE-Advanced Technology Introduction, Rohde & Schwarz [07-2010]
3GPP TE Ad d S
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HISILICON SEMICONDUCTORHUAWEI TECHNOLOGIES CO., LTD. Page 24
Carrier Aggregation CoMP
High Order MRelay
Very promising solution for capacity
Expectation to be deployed by 2013for first
operators with UE support
3GPP standard ready since R10/R11
Currently MIMO2x
UE supporting hig
become available
Available solution by 2015+ for
out-band Relay (Type 1)
3GPP standard available since 3GPP
R10 (2011) for Relay Type 1
UL intra-eNodeB CoMP
rollout w/o impact on l
backhaul Other CoMP opt
and should be d
3GPP standard re
3GPP LTE-Advanced Summary
http://www.sierrawireless.com/en/productsandservices/AirCard/USBModems/~/media/Images/products/AirCard/USB%20Modems/AirCard_312U_313U_320U/312U_v3_newlogo.ashx -
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Thank youwww.huawei.com