LG 55LE7300

44
LED LCD TV SERVICE MANUAL CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. CHASSIS : LA01D MODEL : 55LE7300 55LE7300-UA North/Latin America http://aic .lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com Internal Use Only Printed in Korea P/NO : MFL62863240 (1006-REV00)

Transcript of LG 55LE7300

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CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ......................................................................... 3

SPECIFICATION....................................................................................... 6

ADJUSTMENT INSTRUCTION............................................................... 11

EXPLODED VIEW .................................................................................. 16

SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the

Schematic Diagram and Exploded View.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent

Shock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the

servicing of a receiver whose chassis is not isolated from the AC

power line. Use a transformer of adequate power rating as this

protects the technician from accidents resulting in personal injury

from electrical shocks.

It will also protect the receiver and it's components from being

damaged by accidental shorts of the circuitry that may be

inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,

replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,

over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to

be sure the set is safe to operate without damage of electrical

shock.

Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect an

electrical jumper across the two AC plug prongs. Place the AC

switch in the on position, connect one lead of ohm-meter to the AC

plug prongs tied together and touch other ohm-meter lead in turn to

each exposed metallic parts such as antenna terminals, phone

jacks, etc.

If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 1MΩ and 5.2MΩ.

When the exposed metal has no return path to the chassis the

reading must be infinite.

An other abnormality exists that must be corrected before the

receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor

between a known good earth ground (Water Pipe, Conduit, etc.)

and the exposed metallic parts.

Measure the AC voltage across the resistor using AC voltmeter

with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage

measurements for each exposed metallic part. Any voltage

measured must not exceed 0.75 volt RMS which is corresponds to0.5mA.

In case any measurement is out of the limits specified, there is

possibility of shock hazard and the set must be checked and

repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument’sexposedMETALLIC PARTS

Good Earth Groundsuch as WATER PIPE,

CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

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CAUTION: Before servicing receivers covered by this service

manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on

page 3 of this publication, always follow the safety precautions.

Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power

source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an

explosion hazard.

2. Test high voltage only by measuring it with an appropriate high

voltage meter or other voltage measuring device (DVM,

FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specified otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the

contacts with a pipe cleaner, cotton-tipped stick or comparable

non-abrasive applicator; 10% (by volume) Acetone and 90% (by

volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.6. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks are

correctly installed.

7. Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive

lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily

by static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some field-effect transistors and

semiconductor "chip" components. The following techniques

should be used to help reduce the incidence of component

damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic

charge on your body by touching a known earth ground.

Alternatively, obtain and wear a commercially available

discharging wrist strap device, which should be removed to

prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or

exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES

devices.

4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generate

electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective

package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads

electrically shorted together by conductive foam, aluminum foil

or comparable conductive material).

7. Immediately before removing the protective material from the

leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be

installed.

CAUTION: Be sure no power is applied to the chassis or circuit,

and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion such as

the brushing together of your clothes fabric or the lifting of your

foot from a carpeted floor can generate static electricity

sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within the

range or 500°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed

of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500°F to 600°F)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature

(500°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there

only until the solder flows onto and around both the

component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through

which the IC leads are inserted and then bent flat against the

circuit foil. When holes are the slotted type, the following technique

should be used to remove and replace the IC. When working with

boards using the familiar round hole, use the standard technique

as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gentlyprying up on the lead with the soldering iron tip as the solder

melts.

2. Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the

IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and

solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as

possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with

long nose pliers to insure metal to metal contact then solder

each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuitboard.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as

possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit

board.

3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board to

prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit

board will weaken the adhesive that bonds the foil to the circuit

board causing the foil to separate from or "lift-off" the board. The

following guidelines and procedures should be followed whenever

this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper pattern

side of the circuit board. (Use this technique only on IC

connections).

1. Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good

copper pattern. Solder the overlapped area and clip off any

excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern

at connections other than IC Pins. This technique involves the

installation of a jumper wire on the component side of the circuit

board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly

connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the leadof the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.

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1. Application rangeThis spec sheet is applied LCD TV with LA01D chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25±5ºC, (77°±9ºF), CST: 40±5°C2) Relative Humidity: 65±10%3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)

* Standard Voltage of each product is marked by models4) Specification and performance of each parts are followed

each drawing and specif ication by part number inaccordance with BOM.

5) The receiver must be operated for about 5 minutes prior tothe adjustment.

3. Test method1) Performance: LGE TV test method followed2) Demanded other specification

- Safety : UL, CSA, IEC specification- EMC: FCC, ICES, IEC specification

- Wireless : WirelessHD Specification (Option)

Model Market Appliance

42/47/55LE7300 North America Safety : UL1492, CSA C22.2.No.1,

32/37/42/LE5300 EMC : FCC Class B, IEC Class B

47/55LE5300 Wireless HD: Option

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SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.

4. General Specification(TV)

No Item Specification Remark

1 Receivable System 1) ATSC / NTSC-M

2 Available Channel VHF : 02 ~ 13

UHF : 14 ~ 69

DTV : 02 ~ 69

CATV : 01 ~ 135

CADTV : 01 ~ 135

3 Input Voltage 1) AC 100 ~ 240V 50/60Hz

4 Market North America

5 Screen Size 32”, 37”, 42”, 47”, 55” (1920x1080) FHD, 120Hz

6 Aspect Ratio 16:9

7 Tuning System FS

8 LCD Module LC320EUH-SCA1 LGD 32LE5300-UC(XXXWXXX)

T315HW05-V1 AUO 32LE5300-UC(XXXDXXX)

LC370EUH-SCA1 LGD 37LE5300-UC(XXXWXXX)

T370HW04-V1 AUO 37LE5300-UC(XXXDXXX)

LC420EUH-SCA1 LGD 42LE5300-UC/42LE7300-UA

LC470EUH-SCA1 LGD 47LE5300-UC/47LE7300-UA

LC550EUB-SCA1 LGD 55LE5300-UC/55LE7300-UA

9 Operating Environment Temp : 0 ~ 40 deg

Humidity : ~ 80 %

10 Storage Environment Temp : -20 ~ 60 deg

Humidity : -85 %

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5. Chrominance & Luminance

No. Item Min Typ Max Unit Remarks

1 Max Luminance Module&Set 350 450 cd/m2 32LE5300-UC (LGD module)

(Center 1-point / 360 450 cd/m2 32LE5300-UC (AUO module)

Full White Pattern) 360 450 cd/m2 37LE5300-UC

360 450 cd/m2 42LE5300-UC

360 450 cd/m2 47LE5300-UC

360 450 cd/m2 55LE5300-UC

Module 360 450 cd/m2 42LE7300-UA

Set 300 360 cd/m2 47LE7300-UA/55LE7300-UA

because of Glass filter’s transmittance

2 Luminance uniformity WHITE 5P 1.3 32/37/42/47 inch module

1.4 55 inch module

3 Color coordinate RED X Typ. 0.651 Typ. 32LE5300-UC (LGD module)

(Default) Y -0.03 0.332 +0.03

GREEN X 0.308

Y 0.597

BLUE X 0.149

Y 0.059

WHITE X 0.279

Y 0.292

RED X Typ. 0.640 Typ. 32LE5300-UC (AUO module)

Y -0.03 0.330 +0.03

GREEN X 0.281

Y 0.590

BLUE X 0.144

Y 0.060

WHITE X 0.280Y 0.290

RED X Typ. 0.647 Typ. 37LE5300-UC (LGD module)

Y -0.03 0.332 +0.03

GREEN X 0.306

Y 0.604

BLUE X 0.150

Y 0.058

WHITE X 0.279

Y 0.292

RED X Typ. 0.640 Typ. 37LE5300-UC (AUO module)

Y -0.03 0.330 +0.03GREEN X 0.281

Y 0.590

BLUE X 0.144

Y 0.060

WHITE X 0.280

Y 0.290

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RED X Typ. 0.647 Typ. 42LE5300-UC /

Y -0.03 0.332 +0.03 42LE7300-UA

GREEN X 0.309

Y 0.601

BLUE X 0.149

Y 0.059

WHITE X 0.279

Y 0.292

RED X Typ. 0.649 Typ. 47LE5300-UC /

Y -0.03 0.332 +0.03 47LE7300-UA

GREEN X 0.307

Y 0.595

BLUE X 0.149

Y 0.059

WHITE X 0.279

Y 0.292

RED X Typ. 0.649 Typ. 55LE5300-UC /

Y -0.03 0.332 +0.03 55LE7300-UAGREEN X 0.307

Y 0.595

BLUE X 0.149

Y 0.059

WHITE X 0.279

Y 0.292

4 Color coordinate uniformity N/A

5 Contrast ratio (Module) 3200:1 4000:1 32/37LE5300-UC (AUO module)

900:1 1300:1 32LE5300-UC (LGD module)

1000:1 1400:1 37/42/47/55LE5300-UC

42/47/55LE7300-UA

Contrast ratio (DCR) 2,700,000:1 3,000,000:1 32/37/42/47/55LE5300-UC

42/47/55LE7300-UA

6 Color COOL 0.254 0.269 0.284 13000K ** The W/B Tolerance is

0.258 0.273 0.288 ±0.015 for picture quality

MEDIUM 0.270 0.285 0.300 9300K by DQA.

0.278 0.293 0.308

WARM 0.298 0.313 0.328 6500K

0.314 0.329 0.344

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6. Component Video Input (Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I

2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I

3. 720*480 31.50 60 27.027 SDTV

4. 720*480 31.47 59.94 27.0 SDTV

5. 1280*720 45.00 60.00 74.25 HDTV

6. 1280*720 44.96 59.94 74.176 HDTV

7. 1920*1080 33.75 60.00 74.25 HDTV

8. 1920*1080 33.72 59.94 74.176 HDTV

9. 1920*1080 67.500 60 148.50 HDTV

10. 1920*1080 67.432 59.94 148.352 HDTV

11. 1920*1080 27.000 24.000 74.25 HDTV

12. 1920*1080 26.97 23.976 74.176 HDTV

13. 1920*1080 33.75 30.000 74.25 HDTV

14. 1920*1080 33.71 29.97 74.176 HDTV

7. RGB Input (PC)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

PC DDC

1. 640*350 31.468 70.09 25.17 EGA X

2. 720*400 31.469 70.08 28.32 DOS O

3. 640*480 31.469 59.94 25.17 VESA(VGA) O

4 . 800*600 37.879 60.31 40.00 VESA(SVGA) O

5. 1024*768 48.363 60.00 65.00 VESA(XGA) O

6. 1280*768 47.776 59.87 79.50 CVT(WXGA) X

7. 1360*768 47.712 60.015 85.50 VESA(WXGA) X

8. 1280*1024 63.981 60.020 108.00 VESA(SXGA) O

9. 1920*1080 66.587 59.934 148.5 HDTV 1080P O

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8. HDMI input (PC/DTV)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

PC DDC

1. 640*350 31.468 70.09 25.17 EGA X

2. 720*400 31.469 70.08 28.32 DOS O

3. 640*480 31.469 59.94 25.17 VESA(VGA) O

4 . 800*600 37.879 60.31 40.00 VESA(SVGA) O

5. 1024*768 48.363 60.00 65.00 VESA(XGA) O

6. 1280*768 47.776 59.870 79.50 CVT(WXGA) X

7. 1360*768 47.712 60.015 85.50 VESA(WXGA) X

8. 1280*1024 63.981 60.020 108.00 VESA(SXGA) O

9. 1920*1080 67.5 60 148.5 HDTV 1080P O

DTV

1 720*480 31.5 60 27.027 SDTV 480P

2 720*480 31.47 59.94 27.00 SDTV 480P

3 1280*720 45.00 60.00 74.25 HDTV 720P

4 1280*720 44.96 59.94 74.176 HDTV 720P

5 1920*1080 33.75 60.00 74.25 HDTV 1080I

6 1920*1080 33.72 59.94 74.176 HDTV 1080I

7 1920*1080 67.500 60 148.50 HDTV 1080P

8 1920*1080 67.432 59.94 148.352 HDTV 1080P

9 1920*1080 27.000 24.000 74.25 HDTV 1080P

10 1920*1080 26.97 23.976 74.176 HDTV 1080P

11 1920*1080 33.75 30.000 74.25 HDTV 1080P

12 1920*1080 33.71 29.97 74.176 HDTV 1080P

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ADJUSTMENT INSTRUCTION

1. Application range• This spec. sheet applies to LA01D Chassis applied LCD TV

all models manufactured in TV factory

2. Specification2.1 Because this is not a hot chassis, it is not necessary

to use an isolation transformer. However, the use ofisolation transformer will help protect test instrument.

2.2 Adjustment must be done in the correct order.2.3 The adjustment must be performed in the

circumstance of 25 ± 5 °C of temperature and 65 ± 10% of relative humidity if there is no specif icdesignation.

2.4 The input voltage of the receiver must keep100~240V, 50/60Hz.

2.5 The receiver must be operated for about 5 minutesprior to the adjustment when module is in thecircumstance of over 15

In case of keeping module is in the circumstance of0°C, it should be placed in the circumstance of above15°C for 2 hours

In case of keeping module is in the circumstance ofbelow -20°C, it should be placed in the circumstance ofabove 15°C for 3 hours,.

Caution) When still image is displayed for a period of 20minutes or longer (especially where W/B scale isstrong. Digital pattern 13ch and/or Cross hatchpattern 09ch), there can some afterimage in theblack level area.

3. Adjustment items3.1 Board Level Adjustment

•Adjust 480i Comp1(ADC)•EDID/DDC download

Above adjustment items can be also performed in FinalAssembly if needed. Both Board-level and Final assemblyadjustment items can be check using In-Star Menu 1.ADJUSTCHECK. Component 1080p and RGB-PC Adjust will becalculated by 480i adjust value.

3.2 Final assembly adjustment•White Balance adjustment•RS-232C functionality check•Factory Option setting per destination•Ship-out mode setting (In-Stop)

3.3 Etc•Ship-out mode•Service Option Default•USB Download(S/W Update, Option, Service only)•ISP Download (Optional)

4. Automatic Adjustment4.1. ADC Adjustment

(1) OverviewADC adjustment is needed to find the optimum black leveland gain in Analog-to-Digital device and to compensateRGB deviation.

(2) Equipment & Condition1) Jig (RS-232C protocol)

* Required equipment : Adjustment R/C• Enter Service Mode by pushing “ADJ” key,

• Enter Internal ADC mode by pushing “G ” key at “6. ADCCalibration”

* ADC Calibration Protocol (RS232)

(3) Adjustment1) Adjustment method

- Using RS-232, adjust items listed in 3.1 in the othershown in “4.1.3.3”

2) Adj. protocol

Ref.) ADC Adj. RS232C Protocol_Ver1.0

3) Adj. order- aa 00 00 [Enter ADC adj. mode]- xb 00 40 [Change input source to Component1(480i)]- ad 00 10 [Adjust 480i Comp1]- xb 00 60 [Change input source to RGB(1024*768)]- ad 00 10 [Adjust 1024*768 RGB]- ad 00 90 End adj.

Protocol Command Set ACK

Enter adj. mode aa 00 00 a 00 OK00x

Source change xb 00 40 b 00 OK40x (Adjust 480i Comp1 )

xb 00 60 b 00 OK60x (Adjust 1024*768 RGB)

Begin adj. ad 00 10

Return adj. result OKx (Case of Success)

NGx (Case of Fail)

Read adj. data (main) (main)

ad 00 20 000000000000000000000000007c007b006dx

(sub) (Sub)

ad 00 21 000000070000000000000000007c00830077x

Confirm adj. ad 00 99 NG 03 00x (Fail)

NG 03 01x (Fail)

NG 03 02x (Fail)

OK 03 03x (Success)

End adj. aa 00 90 a 00 OK90x

NO Item CMD 1 CMD 2 Data 0

Enter Adjust A A 0 0 When transfer the ‘Mode In’,

Adjust MODE ‘Mode In’ Carry the command.

ADC adjust ADC Adjust A D 1 0 Automatically adjustment

(The use of a internal pattern)

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5. EDID/DDC Download

(1) OverviewIt is a VESA regulation. A PC or a MNT will display anoptimal resolution through information sharing without anynecessity of user input. It is a realization of “Plug and Play”.

(2) Equipment• Adjust remocon.• Since embedded EDID data is used, EDID download JIG,

HDMI cable and D-sub cable are not need.

(3) Download method1) Press Adj. key on the Adj. R/C,2) Select 10. PCM EDID D/L menu.3) By pressing Enter key, EDID download will begin4) If Download is successful, OK is display, but If

Download is failure, NG is displayed.5) If Download is failure, Re-try downloads.

•Caution) When EDID Download, must remove RGB/HDMICable.

5.1 EDID DATAHDMI1-EDIDBlock 0

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.Only for training and service purposes

0 1 2 3 4 5 6 7 8 9 A B C D E F----------------------------------------------------------------------------------------- 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 14 01 03 80 10 09 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 81 80 61 40 45 40 31 40 01 01 30 | 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 | 45 00 A0 5A 00 00 00 1E 01 1D 00 72 51 D0 1E 20 50 | 6E 28 55 00 A0 5A 00 00 00 1E 00 00 00 FD 00 39 60 | 3F 1F 52 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 04

0 1 2 3 4 5 6 7 8 9 A B C D E F

-------------------------------------------------------------------------------------- 0 | 02 03 1C F1 47 10 22 20 05 84 03 02 23 09 07 07 10 | 67 03 0C 00 10 00 B8 2D E3 05 03 01 02 3A 80 18 20 | 71 38 2D 40 58 2C 04 05 A0 5A 00 00 00 1E 01 1D 30 | 80 18 71 1C 16 20 58 2C 25 00 A0 5A 00 00 00 9E 40 | 01 1D 00 72 51 D0 1E 20 6E 28 55 00 A0 5A 00 00 50 | 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 A0 5A 60 | 00 00 00 18 26 36 80 A0 70 38 1F 40 30 20 25 00 70 | A0 5A 00 00 00 1A 00 00 00 00 00 00 00 00 00 CC

0 1 2 3 4 5 6 7 8 9 A B C D E F -------------------------------------------------------------------------------------- 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 14 01 03 80 10 09 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 81 80 61 40 45 40 31 40 01 01 30 | 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 | 45 00 A0 5A 00 00 00 1E 01 1D 00 72 51 D0 1E 20 50 | 6E 28 55 00 A0 5A 00 00 00 1E 00 00 00 FD 00 39 60 | 3F 1F 52 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 04

0 1 2 3 4 5 6 7 8 9 A B C D E F -------------------------------------------------------------------------------------- 0 | 02 03 1C F1 47 10 22 20 05 84 03 02 23 09 07 07 10 | 67 03 0C 00 20 00 B8 2D E3 05 03 01 02 3A 80 18 20 | 71 38 2D 40 58 2C 04 05 A0 5A 00 00 00 1E 01 1D 30 | 80 18 71 1C 16 20 58 2C 25 00 A0 5A 00 00 00 9E 40 | 01 1D 00 72 51 D0 1E 20 6E 28 55 00 A0 5A 00 00 50 | 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 A0 5A 60 | 00 00 00 18 26 36 80 A0 70 38 1F 40 30 20 25 00 70 | A0 5A 00 00 00 1A 00 00 00 00 00 00 00 00 00 BC

0 1 2 3 4 5 6 7 8 9 A B C D E F -------------------------------------------------------------------------------------- 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 14 01 03 80 10 09 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 81 80 61 40 45 40 31 40 01 01 30 | 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 | 45 00 A0 5A 00 00 00 1E 01 1D 00 72 51 D0 1E 20 50 | 6E 28 55 00 A0 5A 00 00 00 1E 00 00 00 FD 00 39 60 | 3F 1F 52 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 04

0 1 2 3 4 5 6 7 8 9 A B C D E F -------------------------------------------------------------------------------------- 0 | 02 03 1C F1 47 10 22 20 05 84 03 02 23 09 07 07 10 | 67 03 0C 00 30 00 B8 2D E3 05 03 01 02 3A 80 18 20 | 71 38 2D 40 58 2C 04 05 A0 5A 00 00 00 1E 01 1D 30 | 80 18 71 1C 16 20 58 2C 25 00 A0 5A 00 00 00 9E 40 | 01 1D 00 72 51 D0 1E 20 6E 28 55 00 A0 5A 00 00 50 | 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 A0 5A 60 | 00 00 00 18 26 36 80 A0 70 38 1F 40 30 20 25 00 70 | A0 5A 00 00 00 1A 00 00 00 00 00 00 00 00 00 AC

0 1 2 3 4 5 6 7 8 9 A B C D E F -------------------------------------------------------------------------------------- 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 14 01 03 80 10 09 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 81 80 61 40 45 40 31 40 01 01 30 | 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 | 45 00 A0 5A 00 00 00 1E 01 1D 00 72 51 D0 1E 20 50 | 6E 28 55 00 A0 5A 00 00 00 1E 00 00 00 FD 00 39 60 | 3F 1F 52 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 04

0 1 2 3 4 5 6 7 8 9 A B C D E F -------------------------------------------------------------------------------------- 0 | 02 03 1C F1 47 10 22 20 05 84 03 02 23 09 07 07 10 | 67 03 0C 00 40 00 B8 2D E3 05 03 01 02 3A 80 18 20 | 71 38 2D 40 58 2C 04 05 A0 5A 00 00 00 1E 01 1D 30 | 80 18 71 1C 16 20 58 2C 25 00 A0 5A 00 00 00 9E 40 | 01 1D 00 72 51 D0 1E 20 6E 28 55 00 A0 5A 00 00 50 | 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 A0 5A 60 | 00 00 00 18 26 36 80 A0 70 38 1F 40 30 20 25 00 70 | A0 5A 00 00 00 1A 00 00 00 00 00 00 00 00 00 9C

Block 1

Block 1

Block 1

Block 1

RGB-EDID

HDMI2-EDIDBlock 0

HDMI3-EDIDBlock 0

HDMI3-EDIDBlock 0

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5.3. White Balance Adjustment(1) Overview

• W/B adj. Objective & How-it-works- Objective: To reduce each Panel’s W/B deviation- How-it-works: When R/G/B gain in the OSD is at 192, it

means the panel is at its Full DynamicRange. In order to prevent saturation ofFull Dynamic range and data, one ofR/G/B is fixed at 192, and the other two is

lowered to find the desired value.- Adj. condition : normal temperature

1) Surrounding Temperature: 25 ± 5 ºC2) Warm-up time: About 5 Min3) Surrounding Humidity: 20 % ~ 80 %

(2) Equipment1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12)2) Adj. Computer(During auto adj., RS-232C protocol is

needed)3) Adjust Remocon4) Video Signal Generator MSPG-925F 720p/216-Gray

(Model:217, Pattern:78)-> Only when internal pattern is not available

• Color Analyzer Matrix should be calibrated using CS-1000

(3) Adj. Command (Protocol)1) RS-232C Command used during auto-adj.

Ex) wb 00 00 -> Begin white balance auto-adj.wb 00 10 -> Gain adj.

ja 00 ff -> Adj. data jb 00 c0......

wb 00 1f -> Gain adj. complete*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.wb 00 ff -> End white balance auto adj.

(4) Adj. method• Auto adj. method

1) Set TV in adj. mode using POWER ON key2) Zero calibrate probe then place it on the center of the

Display3) Connect Cable(RS-232C)4) Select mode in adj. Program and begin adj.5) When adj. is complete (OK Sing), check adj. status pre

mode (Warm, Medium, Cool)

6) Remove probe and RS-232C cable to complete adj.

* W/B Adj. must begin as start command “wb 00 00” , andfinish as end command “wb 00 ff”, and Adj. offset ifneed

• Manual adj. method1) Set TV in Adj. mode using POWER ON2) Zero Calibrate the probe of Color Analyzer, then place

it on the center of LCD module within 10cm of thesurface..

3) Press ADJ key -> EZ adjust using adj. R/C > 6. White-

Balance then press the cursor to the right (KEYG ).

(When KEY(G ) is pressed 216 Gray internal patternwill be displayed)

4) One of R Gain / G Gain / B Gain should be fixed at192, and the rest will be lowered to meet the desiredvalue.

5) Adj. is performed in COOL, MEDIUM, WARM 3 modesof color temperature.

- If internal pattern is not available, use RF input. In EZAdj. menu 6.White Balance, you can select one of 2Test-pattern: ON, OFF. Default is inner(ON). Byselecting OFF, you can adjust using RF signal in 216Gray pattern.

* Adj. condition and cautionary items1) Lighting condition in surrounding area

Surrounding lighting should be lower 10 lux. Try to

isolate adj. area into dark surrounding.2) Probe location

- LCD: Color Analyzer (CA-210) probe should bewithin 10cm and perpendicular of the modulesurface (80 °~ 100 °)

3) Aging time- After Aging Start, Keep the Power ON status during 5

Minutes.- In case of LCD, Back-light on should be checked

using no signal or Full-white pattern.

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.Only for training and service purposes

Color Analyzer

Computer

Pattern Generator

RS-232C

RS-232C

RS-232C

Probe

Signal Source

* If TV internal pattern is used, not needed

Connection Diagram of Automatic Adjustment

RS-232C COMMANDMeaning

[CMD ID DATA]

wb 00 00 Begin White Balance adj.

wb 00 ff End White Balance adj.(Internal pattern disappeared)

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(5) Reference (White Balance Adj. coordinate and colortemperature)• Luminance: 216 Gray• Standard color coordinate and temperature using CS-

1000

• Standard color coordinate and temperature using CS-210(CH9)

•Standard color coordinate and temperature using CA-

1000 (by H/R time)

5.4. HDCP(High-Bandwidth DightalContents Protection) SETTING

5.5 Option selection per country(1) Overview

- Option selection is only done for models in Non-USANorth America due to rating

- Applied model: LA01D Chassis applied None USAmodel(CANADA, MEXICO)

(2) Method1) Press ADJ key on the Adj. R/C, then select Country

Group Menu2) Depending on destination, select KR or US, then on the

lower Country option, select US, CA, MX. Selection isdone using +, - KEY

5.6. Tool Option selection• Method: Press Adj. key on the Adj. R/C, then select Tool

option.

5.7. Ship-out mode check (In-stop)• After final inspection, press In-Stop key of the Adj. R/C and

check that the unit goes to Stand-by mode.

• After final inspection, Always turn on the Mechanical S/W.

6. GND and HI-POT Test6.1. GND & HI-POT auto-check prepration

1) Check the POWER CABLE and SIGNAL CABLE insertioncondition.

6.2. GND & HI-POT auto-check1) Pallet moves in thhhhhe station.(Power cord/AV cord is

tightly inserted)2) Connect the AV Jack Tester.3) Controller(GWS103-4) on.

4) GND Test(Auto)- If Test is failed, Buzzer operates.- If Test is passed, execute next process (HI-POT test).(Remove AV cord from AV JACK BOX)

5) HI-POT Test(Auto)- If Test is failed, Buzzer operates.- If Test is passed, GOOD Lamp on and move to next

process automatically.

6.3. Check point1) Test voltage

- GND : 1.5 KV/min at 100mA- Signal : 3 KV/min at 100mA

2) Test time : 1 second

3) Test Point- GND Test = POWER CORD GND and SIGNAL CABLEGND.

- HI-POT Test = POWER CORD GND and LIVE &NEUTRAL.

4) LEAKAGE CURRENT : At 0.5mArms

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.Only for training and service purposes

Mode Color Coordination Temp ∆UV

x y

COOL 0.269 0.273 13000K 0.0000

MEDIUM 0.285 0.293 9300K 0.0000

WARM 0.313 0.329 6500K 0.0000

Mode Color Coordination Temp ∆UV

x y

COOL 0.269±0.002 0.273±0.002 13000K 0.0000

MEDIUM 0.285±0.002 0.293±0.002 9300K 0.0000

WARM 0.313±0.002 0.329±0.002 6500K 0.0000

Cool Medium Warm

Aging Time x y x y x y

(Min) 269 273 285 293 313 329

1 0-2 276 285 292 305 315 334

2 3-5 274 282 290 302 313 332

3 6-9 273 280 289 300 312 330

4 10-19 272 278 288 298 311 328

5 20-35 271 276 287 296 310 326

6 36-49 269 274 286 294 309 324

7 50-79 269 273 286 293 308 323

8 Over 80 269 273 285 293 308 323

Model Tool 1 Tool 2 Tool 3 Tool 4 Tool 5 Menu

42LE7300-UA 25184 25874 56356 2829 40

47LE7300-UA 33376 25874 56356 2829 40

55LE7300-UA 45664 25874 56356 2829 40

32LE5300-UC 16608 25874 56356 2829 40 LGD

32LE5300-UC 16616 25874 56356 2829 40 AUO

37LE5300-UC 20704 25874 56356 2829 40 LGD

37LE5300-UC 20712 25874 56356 2829 40 AUO

42LE5300-UC 24800 25874 56356 2829 40

47LE5300-UC 32992 25874 56356 2829 40

55LE5300-UC 45280 25874 56356 2829 41

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LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.Only for training and service purposes

- 15 -

7. USB S/W Download (option)(1) Put the USB Stick to the USB socket(2) Automatically detecting update file in USB Stick

- If your downloaded program version in USB Stick is Low,it didn’t work.But your downloaded version is High, USB data isautomatically detecting

(3) Show the message “Copying files from memory”

(4) Updating is staring.

(5) Updating Completed, The TV will restart automatically

(6) If your TV is turned on, check your updated version andTool option. (explain the Tool option, next stage)* If downloading version is more high than your TV have,

TV can lost all channel data. In this case, you have tochannel recover. if all channel data is cleared, you didn’thave a DTV/ATV test on production line.

* After downloading, have to adjust TOOL OPTION again.1) Push "IN-START" key in service remote controller.2) Select "Tool Option 1" and Push “OK” button.3) Punch in the number. (Each model has their number.)

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LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. - 16 -

3 0 0

2 0 0

8 0 0

L

V 1

L V 2

5

2 1

4 0 0

5 3 0

5 4 0

8 3 0

8 4 0

8 8 0

8 1 0

8 2 0

1 2 0

5 1 1

3 1 0

5

0 0

A 1 0

A 2 1

A 9

5 1 0

7 1 0

9 1 0

9 0 0

A 5

A 2

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These

parts are identified by in the Schematic Diagram and EXPLODED VIEW.

It is essential that these special safety parts should be replaced with the same components as

recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

+ 3 . 5 V_ S T

OCD1B

R1018 22

OCD1A

+3.5V_ST

R1080

22

MODEL1_OPT_2

R 1 0 6 2

2 2

N O N_ M_ R E M O T E

R 10 60 2 2

M_REMOTE

OCD1B

C1003

0.1uF

R 10 67 2 2

R 10 81 2 2

T P

1 0 0 1

OCD1A

R 10 59 2 2

NON_M_REMOTE

I R

R 10 65 2 2R1073 10K

CEC_REMOTE_NEC

IC

UPD78F05

NEC

1P60/SCL0

2P61/SDA0

3P62/EXSCL0

4P63

5P33/TI51/TO51/INTP4

6P75

7P74

8P73/KR3

9P72/KR2

10P71/KR1

11P70/KR0

12P32/INTP3/OCD1B

1 3

P 3 1 / I N T P

2 / O C D

1 A

1 4

P 3 0 / I N T P

1

1 5

P 1 7

/ T I 5

0 / T O 5

0

1 6

P 1 6 / T O H

1 / I N T P 5

1 7

P 1 5

/ T O H

0

P 1 4

/ R X D

6

F L M D

0

4 4

P 1 2 2 / X

2 / E X C L K

/

O C D

0 B

4 5

P 1 2 1 / X

1 / O C D

0 A

4 6

R E G C

4 7

V S S

4 8

V D D

FLMD0

R1019 22

R 10 23 2 2

P O W E R_

D E T

R 1 0 6 1

2 2

M_ R E M O T E

NEC_ISP_Tx

P100112505WS-12A00

MICOM_DEBUG

1

2

3

4

5

6

7

8

9

10

11

12

13

OCD1B

POWER_ON/OFF2_1

NEC_ISP_Rx

R 10 07 1 00

IC1001

M24C16-WMN6T

3NC/E2

2NC/E1

4VSS

1NC/E0

5SDA

6SCL

7WC

8VCC

R 10 76 2 2

NEC_SCL

+3.5V_ST

MODEL1_OPT_3

GND

R 1 0 6 9

2 2

+3.5V_ST

MODEL1_OPT_1

MICOM_RESET

C 1 0 0 2

0 . 1 u F

RF_RESET

R 1 0 1 4

4 . 7 K

R 1 0 0 1

4 7 K

TP1002

L E D_ B / L G_ L

O G O

R 10 70 1 00

F L M D 0

NEC_EEPROM_SDA

NEC_SDA

INV_CTL

NEC_EEPROM_SDA

TP1003

R1005 10KAMP_MUTE

NEC_ISP_Rx

AMP_RESET_N

PANEL_CTL

O C D 1 A

R1072 10K

R 10 63 2 2

C 1 0 0 6

0 . 1 u F

R 10 64 2 2

MODEL1_OPT_0

+3.5V_ST

R 10 66 2 2

R1008

22

+3.5V_ST

NEC_EEPROM_SCL

MODEL1_OPT_0

R 1 0 1 5

4 . 7 K

R 1 0 6 8

2 2

NEC_ISP_Tx

NEC_EEPROM_SCL

R F_ E N A

B L E

R 10 10 2 2

R 10 13 2 2

MODEL1_OPT_1

R 10 78 2 2

L E D_ R / B

U Z Z

R1006 10K

SOC_RESET

R1002 10K

R1084

10K

OPT

+3.5V_ST

R 1 0 8 6

4 7 K

O P T

+ 3 . 5 V_ S T

R 1 0 7 1

1 0 K

B / L_ L E D

R 1 0 1 1

1 0 K

T A C T_ K E Y

R 1 0 0 4

1 0 K

P W M_ L E

D

R 1 0 1 2

1 0 K

B / L_ L A M P

R 1 0 0 9

1 0 K

P W M_ B U Z Z / I I C_ L E D

R 1 0 7 5

1 0 K

T O U C H_ K E Y

R 1 0 7 4

1 0 K

N O N_ G P I O_ L E D

R 1 0 7 9

1 0 K

G P I O_ L E D

R 1 0 3 0

1 0 K

R1091 10K

CEC_ON/OFFR 10 03 0

R 10 20 0

C 1 0 0 7

1 5 p F

C

for Debugger

MICOM MODEL OPTION

EEPROM for Micom

B/L_LED

PIN NO.

11

HIGH

MODEL OPTION

B/L_LAMP

MODEL_OPT_2

MODEL_OPT_0

LOWPIN NAME

MODEL_OPT_1

8

MODEL_OPT_3

30

3 1 G PI O_ LE D NON_GPIO_LED

T OU CH _ KE Y T A CT _K E Y

PWM_LEDPWM_BUZZ/IIC_LED

MODEL_OPT_1 MODEL_OPT_2MODEL_OPT_0 MODEL_OPT_3

LOW LOW LOW LOW

LOW LOW

LOW

LOWLOWLOW

HIGH HIGH

HIGH HIGH HIGH

HIGH

HIGH LOW

LD350/450/550

19/22/26LE3300(5500)

32/37/42/47/55LE5300(10)

LD420

LE7300

HIGH HIGH TBD

LOWHIGH

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F

i b er

O p ti

c

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

DSUB_R

SPDIF_OUT

2:X18

R110815K

DSUB_G

DSUB_G

C1108

100pF50V

R112622

OPT

DSUB_HSYN

R110715K

R1103

470K

PC_R_IN 2:S16

DSUB_R

R111110K

D1101

5.6VOPT

AMOTECH

C1117

0.1uF

16V

OPTR1102470K

DSUB_B

J K 1 1 0 3

J S T 1 2 2 3 - 0 0 1

1GND

2VCC

3VINPUT

4

F I X_ P O L E

+3.3V_Normal

C1121

100pF

50V

DSUB_B

DSUB_VSYN

R111010K

C1107100pF50V

D1102

5.6VOPT

AMOTECH

PC_L_IN 2:S16

IC1104

NL17SZ00DFT2G

OPT

3GND

2B

4Y

1A

5VCC

R1127

0

C1131

0.1uF

16V

R1152

4.7K

OPT

Q1103

MMBT3904-(F)

E

B

C

HP_ROUT

2:X19

+3.5V_ST R 1 1 3 0

1 0 K

C1115

1000pF

50VOPT

SIDE_HP_MUTE

C1116

1000pF

50VOPT

+3.3V_Normal

SPK_R-_HOTEL

2:X19

SPK_R+_HOTEL

2:X19

HP_DET

R11551K

HP_LOUT

2:X19

Q1101

MMBT3904-(F)

E

B

C

Q1102

MMBT3904-(F)

E

B

C

C1119

10uF

16V

EXCEPT_CHINA_HOTEL_OPT

C1118

10uF

16V

EXCEPT_CHINA_HOTEL_OPT

Q1104

MMBT3904-(F)

E

B

C

R11251K

R11281K

JK1102

PEJ027-01

6B T_TERMINAL2

7B B_TERMINAL2

5 T_SPRING

4 R_SPRING

7A B_TERMINAL1

6A T_TERMINAL1

3 E_SPRING

R11120

R11130

JK3301

KJA-PH-0-0177

3DETECT

4L

5GND

1R

Q

1 1 0 5

I

S A 1 5 3 0 A C 1

E

B

C

Q1106

2SC3052E

B

C

R11293.3K

5.15 Mstar Circuit Application

PC AUDIO RGB SPDIF OPTIC JACK

COMMON AREANew Item DevelopmentEARPHONE BLOCK

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

C1101 0.33uF

C11050.1uF

R1157 0

R1156 0N

C1106

0.1uF

+3.5V_ST

R1153 0

R1154 0

D1108

30VCDS3C30GTH

IR_OU

C11030.1uF

S7

D1107

30VCDS3C30GTH

R1114

4.7K

OPT

NE

IC1101

MAX3232CDR

EAN41348201

3C1-

2V+

4C2+

1C1+

6V-

5C2-

7DOUT2

8RIN2

9ROUT2

10DIN2

11DIN1

12ROUT1

13RIN1

14DOUT1

15GND

16VCC

C11040.1uF

R1109

4.7KOPT

C11020.1uF

+3.5V_ST

S

RS232C

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

+3.3V_Normal

S7_TXD

R 2 6 1 0 4 7 K

O P T

R2601 0

WIRELESS

R26070

1/4W

WIRELESS

3216

S7_RXD

R2606

0

OPT

R260310K

WIRELESS

+24V

R260422K

R2608

0

OPT

C2601

0.1uF

50V

WIRELESS_DL_RX

C26030.01uF50V

R 2 6 0 9

4 . 7 K

O P T

WIRELESS_TX

Q2601

WIRELESSE

B

C

S7_TXD1

WIRELESS_PWR_EN

S7_RXD1

C2602

2.2uF

+3.5V_ST

C2604

0.1uFOPT

+3.5V_ST

WIRELESS_SW_CTRL

+3.3V_Normal

WIRELESS_DETECT

WIRELESS_SCL

WIRELESS_RX

R2617 1K

WIRELESS_SDA

WIRELESS_TX

R2612

10K

R2615 0

WIRELESS

WIRELESS_RX

WIRELESS_DL_TX

IC2601

MC14053BDR2G

OPT

3Z1

2Y0

4Z

1Y1

6INH

5Z0

7VEE

8VSS

9C

10B

11A

12X0

13X1

14X

15Y

16VDD

IR_PASS

R2618 0

R26190

TP2601

TP2602

R2620 0

WIRELESS

JK2601

KJA-PH-3-0168

14GND_3

13I2C_SDA

5

VCC[24V/20V/17V]_5

12I2C_SCL

11GND_2

2VCC[24V/20V/17V]_2

19GND_5

18IR

10RESET

4VCC[24V/20V/17V]_4

1VCC[24V/20V/17V]_1

17GND_4

9GND_1

8INTERRUPT

3VCC[24V/20V/17V]_3

16UART_TX

7DETECT

6VCC[24V/20V/17V]_6

15UART_RX

20GND_6

21

SHIELD

Q2602

WIRELESS

AO3407A

G

D

S

R260527K

WIRELESS_PWR_

AMP

AMP

X0/Y0/Z0

X1/Y1/Z1

SELECT PIN

LOW

HIGH

WIRELESS READY MODEL

WIRELESS Don

Wireless power

WIRELESS Don

RS232C & Wireles

WIRELESS_SW_CTRL

Ver. 1.2 --

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US

B

DOWN

STREAM

HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

SSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

HE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

S I G N 6 4 0 9

R1453 0

D1452

5.6V

CDS3C05HDMI1

OPT

J

K 1 4 5 0

K J A

- U B - 4 - 0 0 0 4

1

2

3

4

5

L1451

MLB-201209-0120P-N2

120-ohm

SIDE_USB_DP

SIDE_USB_DM

R1452 0

TP1451

D1451

5.6VCDS3C05HDMI1

OPT

/RST_HUB

IC1450

AP2191SG-13

3IN_2

2IN_1

4EN

1GND

5FLG

6OUT_1

7OUT_2

8NC

C1452

10uF

10V

+5V_USB

C1453

0.1uF

R

4OP

+3.3V

R1

R145410K

R1451 47 USB1_OCD

C1451

22uF

16V

USB_DIODES

$0.077

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

SPI_SCK/FLASH_WP

R14020

R1401

0OPT

/SPI_CS

R 1 4 0 4

4 . 7 K

C1401

0.1uF

+3.3V_Normal+3.3V_Normal

Q1401

KRC103S

E

B

C

+3.3V_Normal

R 1 4 0 3

1 0 K

R140533

SPI_SDO

SPI_SDI

IC1401

MX25L8005M2I-15G

S_FLASH

3WP#

2SO

4GND

1CS#

5SI

6SCLK

7HOLD#

8VCC

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THERMAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L502

B L M 1 8 P G 1 2 1 S N 1 D

0.1uFC519

50V

C5061000pF

50V

C530390pF50V

AUD_MASTER_CLK

C528

10uF

35V

L504

B L M 1 8 P G 1 2 1 S N 1 D

+1.8V_AMP

C5020.1uF

16V

C525

22000pF

50V

R517

10K

C51822000pF50V

C5201uF25V

C529390pF50V

AMP_SCL

D504

100V

1N4148W

OPT

C5081000pF50V

C522

1uF25V

0.1uF

C527

50V

+3.5V_ST

R 50 3 1 00

C531390pF50V

R 50 5 1 00

AUD_LRCH

+24V

D501

100V

1N4148W

OPT

D503

100V

1N4148W

OPT

R 51 4 1 0 0

C512

1uF 25V

C532390pF50V

C5171uF

25V

R5130

OPT

C504

100pF

50V

AMP_MUTE

R508

3.3K

AMP_SDA

AUD_LRCK

L501

B L M 1 8 P G 1 2 1 S N 1 D

+1.8V_AMP

R 50 4 1 00

POWER_DET

AMP_RESET_N

C521

10uF

35V

C524

22000pF50V

+1.8V_AMP

C514

22000pF

50V

D502

100V

1N4148W

OPT

AUD_SCK

0.1uFC515

50V

+24V

R51510K

0.1uF

C513

16V

0.1uFC509

0.1uFC505

16V

0.1uF

C526

50V

Q501

2SC3052

E

B

C

+3.3V_Normal

C516

1000pF

50V

R5353.3

OPT

C547

0.01uF

50V

OPT

A M P_ M U T E_ H O T E L

C50110uF10V

OPT

C50310uF10V

OPT

C51110uF

10V

OPT

R52612

R52212

R52012

R52512

R51912

R52412

R52112

R52312

C546

22pF

50V

OPT

C545

22pF

50V

OPT

C544

22pF

50V

OPT

T P 5 0 2

C434

0.1uF

16V

+1.8V_AMP

+3.3V_Normal

C421

10uF

10V

IC404

AP1117E18G-13

2

OUT

3IN 1 ADJ/GND

C446

0.1uF

16V

R 4 7 4

1

L507

AD-9060

15uH

2S

1S 1F

2F

L506

AD-9060

15uH

2S

1S 1F

2F

IC501

NTP-7000

EAN60969601

1BST1A

2VDR1A

3/RESET

4AD

5DGND_1

6GND_IO

7CLK_I

8VDD_IO

9DGND_PLL

10AGND_PLL

11LF

12AVDD_PLL

13DVDD_PLL

14GND

1 5

D G N D_

2

1 6

D V D D

1 7

S D A T A

1 8

W C K

1 9

B C K

2 0

S D A

2 1

S C L

2 2

M O N I T O R 0

2 3

M O N I T O R 1

2 4

M O N I T O R 2

2 5

/ F A U L T

2 6

V D R 2 B

2 7

B S T 2 B

2 8

P G N D 2 B_

1

29 PGND2B_2

30 OUT2B_1

31 OUT2B_2

32 PVDD2B_1

33 PVDD2B_2

34 PVDD2A_1

35 PVDD2A_2

36 OUT2A_1

37 OUT2A_2

38 PGND2A_1

39 PGND2A_2

40 BST2A

41 VDR2A

42 NC

4 3

V D R 1 B

4 4

B S T 1 B

4 5

P G N D 1 B_

1

4 6

P G N D 1 B_

2

4 7

O U T 1 B_

1

4 8

O U T 1 B_

2

4 9

P V D D 1 B_

1

5 0

P V D D 1 B_

2

5 1

P V D D 1 A_

1

5 2

P V D D 1 A_

2

5 3

O U T 1 A_

1

5 4

O U T 1 A_

2

5 5

P G N D 1 A_

1

5 6

P G N D 1 A_

2

57

E P_ P A D

C507

18pF

50V

C510

18pF

50V

R 50 6 3 3

R 50 7 3 3

Vd=1.4V 120 mA

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

BT_LOUT

BT_DM

BT_ON/OFF

BT_DP

NOT USING B/T

Page 35: LG 55LE7300

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

PCM_D[2]

PCM_D[6]

FE_TS_DATA[5]

FE_TS_DATA[7]

FE_TS_DATA[3]

PCM_D[1]

FE_TS_DATA[0]

FE_TS_DATA[6]

FE_TS_DATA[4]

PCM_D[3]

PCM_D[7]

FE_TS_DATA[1]

PCM_D[5]

PCM_D[4]

PCM_D[0]

FE_TS_DATA[2]

PCM_A[13]

/PCM_IORD

CI_TS_DATA[7]

CI_TS_CLK

CI_TS_SYNC

PCM_A[14]

/PCM_REG

CI_TS_DATA[5]

PCM_A[12]

/PCM_CD

PCM_A[10]

CI_TS_DATA[3]

FE_TS_VAL_ERR

PCM_A[8]

/PCM_WE

PCM_A[3]CI_TS_DATA[4]

CI_TS_DATA[1]

CI_TS_DATA[0]

/PCM_IOWR

PCM_A[0]

PCM_A[4]

FE_TS_CLK

PCM_5V_CTL

PCM_RST

PCM_A[11]

PCM_A[6]

PCM_A[9]

FE_TS_SYNC

PCM_A[2]

PCM_A[5]

/PCM_IRQA

/PCM_WAIT

CI_TS_VAL

/PCM_CE

FE_TS_DATA[0-7]

CI_TS_DATA[2]PCM_A[1]

PCM_A[7]

/PCM_OE

CI_TS_DATA[6]

PCM_D[0-7]

NON CI Region

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TP2109

EPHY_TXD1

EPHY_RXD1

EPHY_CRS_DV

TP2107

TP2111

/RST_PHY

TP2101

EPHY_EN

TP2110

TP2108

TP2104

TP2103

EPHY_RXD0

EPHY_REFCLK

EPHY_MDIO

TP2106

EPHY_MDC

EPHY_TXD0

TP2105

ET_RXER

TP2102

NON ETHERNET

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TP2502

TP2501

TP2504 RF_ENABLE

RF_RESET

M_REMOTE_TX

M_REMOTE_RX

TP2503

NON Motion Remocon Region

Page 38: LG 55LE7300

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

AMP_MUTE_HOTEL

SPK_R-_HOTEL

SPK_R+_HOTEL

NON CHINA HOTEL

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

SIDEAV_L_IN

SIDEAV_R_IN

SIDEAV_CVBS_IN

SIDEAV_DET

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

S I G N 4 2 7 2

C9800100pF50V

OPT

D98065.6V

R98060

D9802

30V

R98040

D98085.6V

D9800

5.6V

D98015.6V

R980010K

R980210K

AV_CVBS_DET

D98055.6V

+3.3V_Normal

D980430V

+3.3V_Normal

D980330V

COMP2_DET

R98011K

D98075.6V

D980930V

R98031K

R98050

TP9809

TP9803

TP9801

TP9802

SC1_CVBS_IN

TP9808

TP9807

TP9804

TP9806

TP9805

JK9800

PPJ238-01

5D [GN2]O-SPRING

6D [GN2]E-LUG

4D [GN2]CONTACT

7E [BL2]E-LUG-S

5E [BL2]O-SPRING

7F [RD2]E-LUG-S

5F [RD2]O-SPRING_1

5G [WH2]O-SPRING

4H [RD2]CONTACT

5H [RD2]O-SPRING_2

6H [RD2]E-LUG

6A [YL1]E-LUG

5A [YL1]O-SPRING

4A [YL1]CONTACT

5B [WH1]O-SPRING

4C [RD1]CONTACT

5C [RD1]O-SPRING

6C [RD1]E-LUG

SCART OPTIO

SMALL_US_KR_EM_JACK PACK_HONGSU_090818

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

C9901

100pFSIDE_CVBS

D990730V

SIDE_COMP

R990410K

SIDE_COMP

D990630V

SIDE_COMP

SC1_B-/COMP1_Pb-

R9905470K

SIDE_CVBS

R990875

SIDE_COMP

D9901

30V

SIDE_CVBS

ADUC30S03010L_AMODIODE

L9902BLM18PG121SN1D

SIDE_CVBS

SIDEAV_DET

+3.3V_Normal

R99151K

SIDE_CVBS

D990530V

SIDE_COMP

SIDEAV_CVBS_IN

D99045.6V

SIDE_CVBS

ADMC5M03200L_AMODIODE

SIDEAV_L_IN

R9913

10K

SIDE_CVBS

R991075

SIDE_COMP

C9904

10pF

50V

OPT

C9907

100pF

OPT

JK9901

KJA-PH-1-0177

SIDE_CVBS

3 M3_DETECT

4 M4

5 M5_GND

1 M1

6 M6

D99085.6V

SIDE_COMP

R99121K

SIDE_COMP

JK9902

KJA-PH-1-0177

SIDE_COMP

3 M3_DETECT

4 M4

5 M5_GND

1 M1

6 M6

D99025.6V

SIDE_CVBS

ADMC5M03200L_AMODIODE

R9911

10KSIDE_CVBS

R9914

10K

SIDE_CVBS

SC1_R+/COMP1_Pr+

R990975

SIDE_COMP

R9906

470K

SIDE_CVBS

R991612K

SIDE_CVBS

D99035.6V

SIDE_CVBS

ADMC5M03200L_AMODIODE

R9901 0

SIDE_COMP

R991712K

SIDE_CVBS

+3.3V_Normal

C9906

100pF50V

SIDE_CVBS

R9903 0

SIDE_COMP

C9903

10pF 50V

OPT

SIDEAV_R_IN

SC1_B+/COMP1_Pb+

L9901BLM18PG121SN1D

SIDE_CVBS

SC1/COMP1_DET

C9905100pF

50V

SIDE_CVBS

SC1_G-/COMP1_Y-

R990775

SIDE_CVBS

SC1_G+/COMP1_Y+

SC1_R-/COMP1_Pr-

C990210pF 50V

OPT

R9902 0

SIDE_COMP

L9903

BLM18PG121SN1D

SIDE_CVBS

SIDE CVBS PHONE JACK

SIDE_GENDER_3 SIL

(LA/TA/MA/SA)

(New Item Development)

(New Item Developmen)

SIDE COMPONENT PHONE JACK

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

DEMOD_RESET

IF_P_EXT

IF_N_EXT

DEMOD_SCL

DEMOD_SDA

C24061000pF50V

C2407100pF50V

Q2402

2SC3052

Commercial

E

B

C

L2403

BLM18PG121SN1D

R243147K

D24025.6V

AMOTECH

C2408

1000pF

50VOPT

+3.5V_ST

C24041000pF50V

IR_OUT

Q2405

2SC3052E

B

C

IR_PASS

R242147K

WIRELESS

R2402100

Q2403

2SC3052

WIRELESS

E

B

C

R2426

3.3K

OPT

R2405

10K

1%

+3.5V_ST

R2425

47K

R24270

OPT

R 24 1 3 1 . 5K

NON_LE7300

D24015.6V

AMOTECH

R2420

47K

WIRELESS

R24220

Commercial_US

+3.5V_ST

R2404

10K1%

C24050.1uF

16V

R240322

Commercial

D24055.6B

R240947K

Commercial

R2406

47K

Commercial_EU

R240710K

Commercial_EU

R2412

100

EYEQ/TOUCH_KEY

+3.5V_ST

+3.5V_ST

Q2401

2SC3052

Commercial_EU E

B

C

R241810K

WIRELESS

IR

Q2404

2SC3052

WIRELESS E

B

C

+3.5V_ST

R241722

WIRELESS

LED_B/LG_LOGO

C2409

1000pF

50VOPT

+3.5V_ST

+3.5V_ST

C24020.1uF

KEY2

R243010K

R2401100

NEC_EEPROM_SCL

Q2406

2SC3052E

B

C

R242822

C24100.1uF16V

OPT

L2404

BLM18PG121SN1D

R2411100

EYEQ/TOUCH_KEY

+3.3V_Normal

+3.5V_ST

R2408

47K

Commercial

KEY1

D24045.6B

L2401

BLM18PG121SN1D

R2416

10K

OPT

R2429

47K

D2403

5.6B

NEC_EEPROM_SDAL2402

BLM18PG121SN1D

C24030.1uF

16V

C24010.1uF

R2410100

R2419

47K

WIRELESS

P2401

12507WR-12L

1SCL

2SDA

3GND

4KEY1

5KEY2

63.5V_ST

7GND

8LED_B

9IR

10GND

113.3_NORMAL

12LER_R

13

.

Q24002SC3052

LE7300E

B

C

R2424120KOPT

+3.5V_ST

R24324.7K

LE7300

LED_R/BUZZ

+3.5V_ST

R242310K

OPT

L2405BLM18PG121SN1D

LE7300

R24150

IF_AGC_MAINIF_AGC

R2433

1.5K

NON_LE7300

R2414

0

R24344.7K

LE7300

+3.5V_ST

IR & EYE & KEY & LED (LA01D N.AMERICA)

WIRELESS

COMMERCIAL

NON_LE7300

5V_Normal

Locate the Zener Diode to wafer closly

ST_LED

LE7300

IF AGC

DEMOD

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