2newsletterVerantw. Uitg.: Peter Simkens | DSP Valley vzw., Gaston Geenslaan 9, 3001 Leuven, Belgiumtel. +32 (0) 16 24 14 40 | fax +32 (0) 16 24 14 49 | www.dspvalley.com

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designing smart products

April - Mei ‘16 | 17de jaargang - nr. 2 | verschijnt tweemaandelijks | afgiftekantoor: 2800 Mechelen 1 | www.dspvalley.com | P2A6695

Preface 4

Technology Flash 1u Imec and Vrije Universiteit Brussel Present Small, Low-Cost and 1

Low-Power Chip for multi-gigabit 60GHz Communication

In the spotlights 2u Averna Acquires Leading European Company Test & Measurement Solutions 2

u Imec and iMinds to Merge and Create High-Tech Research Center Driving 2

the Digital Economy

u MathWorks Announces Release 2016a of the MATLAB and 4

Simulink Product Families

u Greenpeak - Smart Home Services – A window of opportunity for Operator success 5

u Fourtress - Programming a kiss 6

u Sensimed receives FDA product approval for its Contact Lens with AnSem ASIC 7

u DSP Valley, partner of the Silicon Europe Alliance 8

u 5 reasons why IoT design needs custom ESD protection - Sofics 9

u A warm welcome for Jeroen Tuik as the new CEO of Connect Group 10

u ICsense has a new website 10

Embedded corner 11u Embedded World 2015 ... It’s a smarter world 11

u New picoTCP solution – Altran Intelligent Systems 11

u Meet the DragonBoard 410c from Arrow and Qualcomm 12

Upcoming events 13

Contact Information 16

Imec and Vrije Universiteit Brussel Present Small, Low-Cost and Low-Power Chip for multi-gigabit 60GHz Communication

continuation on page 3

At IEEE International Solid-State Circuits

Conference (ISSCC2016), nanoelectronics

research center imec presented different

breakthroughs in their research into wire-

less communication. One of the highlights

was a four-antenna path beamforming

transceiver for 60GHz multi Gb/s com-

munication in 28nm CMOS technology.

The transceiver is a breakthrough in devel-

oping a small, low-cost, and low power

solution for multi-gigabit communication

targeting WiGig® as well as 60GHz wire-

less backhaul applications.

2newsletter

With this Acquisition, Averna Becomes a Truly Global Test-Solution Provider for Clients in North America, Europe and AsiaAverna, an industry-leading developer of

test solutions and services for communi-

cations and electronics device-makers

worldwide, announced today that it has

acquired 100 percent of Europe-based

Test & Measurement Solutions for an

undisclosed amount.

T&M Solutions develops multidiscipli-

nary solutions to test, measure, inspect,

assemble and validate products in nearly

all segments of the production industry.

Headquartered in Belgium and with

offices in the Netherlands and Poland,

T&M Solutions is a National Instruments

Gold Alliance Partner and has 100

employees, including 70 engineers with

almost 50 NI certifications.

This acquisition increases Averna’s glob-

al reach as well as provides a strong local

presence in Europe, enabling Averna to

enter this market with a well-estab-

lished and respected solution provider

while giving it a springboard for fur-

ther European deployments. In addition,

T&M Solutions brings unique expertise

in semiconductor testing, vision inspec-

tion systems and precision assembly to

complement Averna’s existing solutions

and industry strengths.

T&M Solutions’ management, including

current owners Roel Geraerts and Kurt

Hensen, will continue to play key roles in

operations and expansion plans for the

European market.

“This major expansion into Europe

signals Averna’s strategic positioning

to accelerate growth and become a

truly global Test Engineering power-

house. Test & Measurement Solutions

and Averna share complementary solu-

tion portfolios, clients and partners,

so this is a real win-win arrangement

for everyone,” said François Rainville,

Vice-President of Sales & Marketing

for Averna. “We are proud to welcome

T&M Solutions’ customers and employ-

Averna Acquires Leading European Company Test & Measurement Solutions

Nanoelectronics research center imec,

and digital research and incubation cent-

er, iMinds announced that its respective

board of directors have approved the

intention to merge the research centers.

Using the imec name, the combined enti-

ties will create a world-class, high-tech

research center for the digital economy.

The transaction is expected to be com-

pleted by the end of 2016, with the unit-

ed organization staged to bring added

value to existing partners while further

strengthening Flanders’ authority as a

technology epicenter and region focused

on creating a sustainable digital future.

iMinds will be integrated as an addition-

al business unit within imec, resulting

in a new research center that will fuse

the technology and systems expertise

of more than 2,500 imec researchers

worldwide with the sophisticated digital

competencies of some 1,000 iMinds

researchers representing nearly 50

nationalities. The additions of iMinds’

flagship open innovation research model

-ICON- (in which academic researchers

and industry partners jointly develop

solutions for specific market needs),

iStart entrepreneurship program (sup-

porting start-up businesses), and Living

Labs will strengthen the unique capabili-

ties and assets of imec as a research and

development center.

Imec has been a global leader in the

domain of nanoelectronics for more

than 30 years, and has innovated appli-

cations in smart systems for the Internet

of Things (IoT), Internet of Health, and

Internet of Power. It has built an exten-

sive and worldwide partner network, as

well as in Flanders, and has generated

successful spin-offs. iMinds’ activities

span research domains such as the IoT,

digital privacy and security, and the con-

version of raw data into knowledge. Its

software expertise is widely renowned

and its entrepreneurship activities in

Flanders are first-rate.

“The proliferation of the Internet of

Everything has created a need for solu-

tions that integrate both hardware and

software. Such innovative products that

optimally serve tomorrow’s digital econ-

omy can only be developed through

intense interaction between both

worlds. There are infinite opportunities

in domains such as sustainable health-

care, smart cities, smart manufacturing,

smart finances, smart mobility, smart

grids, or in short, smart everything.

Research centers such as imec, with its

widely acclaimed hardware expertise,

and iMinds, an expert in software and

ICT applications, are uniquely positioned

to bring these concepts to life,” stated

Luc Van den hove, president and CEO

Imec and iMinds to Merge and Create High-Tech Research Center Driving the Digital Economy

2

continuation from page 1

I N T H E S P O T L I G H T S

TE

CH

NO

LO

GY

F

LA

SHDue to the tremendous growth of

mobile data traffic, display and audio

applications, new spectral resources

in the mm-wave frequency bands are

needed to support user demand for

high data rates. One way to realize this

is through mm-wave wireless networks

based on small outdoor cells featuring

beamforming, a signal processing tech-

nique using phased antenna arrays for

directional transmission or reception.

The beamforming steers the radiation

in the desired direction while achieving

a good link budget that supports high

spectral efficiency.

Imec’s and VUB’s 60GHz transceiver

architecture features direct conversion

and analog baseband beamforming

with four antennas. The architecture

is inherently simple and is not affect-

ed by image frequency interference.

Moreover, a 24GHz phase-locked loop

that subharmonically locks a 60GHz

quadrature oscillator is inherently

immune to the pulling disturbance of

the 60GHz power amplifier.

The prototype transceiver chip (7,9mm2),

implemented in 28nm CMOS, integrates

a four-antenna array. The chip was

validated with a IEEE 802.11ad stand-

ard wireless link of 1m. The transmit-

ter consumes 670mW and the receiver

431mW at 0.9V power supply. The

transmitter-to-receiver EVM was better

than -20dB in all the four WiGig® fre-

quency channels (58.32, 60.48, 62.64

and 64.8 GHz), with a transmitter equiv-

alent isotropic radiated power (EIRP) of

24dBm. This allows for QPSK as well as

16QAM modulations according to the

IEEE 802.11ad standard, achieving very

high data rates up to 4.62 Gbps.

n

ees while providing all our customers

with additional expertise and increased

worldwide presence.”

André Gareau, Averna’s President and

CEO, added “We’re building a strong

track record of successful acquisitions

and are motivated by our robust pipe-

line of opportunities in Europe and

around the world. These are exciting

times for Averna and the industry as our

leading test expertise, rapid processes

and global support continue to dem-

onstrate that we are a strategic-value

partner for our clients’ ongoing product

quality and market goals.”

“We are very excited to become part

of Averna, a leading player in our field.

This transaction creates a unique stra-

tegic opportunity as we combine T&M

Solutions’ mature European presence

and respected expertise with Averna’s

expansive global footprint and renowned

products and solution delivery capabili-

ties,” commented Kurt Hensen, CEO of

Test & Measurement Solutions. “As part

of Averna, our portfolio will deliver even

greater value as we remain focused on

our strengths and customers.”

The New Averna at a Glance• Global test-solution company with

offices in North America, Europe and

Asia

• Strong local presence wherever

Averna customers develop and test

their products

• Over 425 employees, including more

than 200 engineers with 125-plus NI

certifications

• Huge portfolio of off-the-shelf prod-

ucts and custom solutions (4200+

completed projects)

• Leader at the forefront of test and RF

innovation with worldwide Centers of

Excellence n

of imec. “Furthermore, iMinds is widely

recognized for its business incubation

programs and open access to SMEs,

and, this merger provides us with a

unique opportunity to jointly reach out

to the Flemish industry and further ele-

vate Smart Flanders on the global map.”

“Flanders faces the enormous chal-

lenge of realizing a successful transition

towards tomorrow’s digital society; a

transition that must happen quickly,

considering the urgency to reinforce

Flanders’ industrial position,” comment-

ed Danny Goderis, CEO of iMinds. “The

merger between imec and iMinds is

Flanders’ answer to this rapidly acceler-

ating digitization trend. We have a clear

ambition to pair more than 3,500 top

researchers across 70 countries with an

ecosystem of Flemish companies and

start-ups, thereby significantly increas-

ing our economic and societal impact.

Together, we can help Flanders boost

its competitiveness and claim a strong

international position.”

Now that the intention to merge has

been approved, the merger protocol

will be developed and the integration

process of imec and iMinds will be initi-

ated immediately. The current iMinds

activities will constitute a third pillar next

to imec’s units. iMinds will remain head-

quartered in Ghent with its researchers

spread across the Flemish universities.

The ambition is to operate as one

organization by the end of 2016.

Flemish Minister of Innovation Philippe

Muyters welcomes the fact that iMinds

and imec join forces: “Thanks to their

pioneering work in their respective

fields, they have put themselves on the

world map. When they were founded,

the line between hardware and software

was still very clear. Today, and especially

in the future, this line is increasingly

blurring – with technology, systems and

applications being developed in close

conjunction. The merger anticipates this

trend and creates a high-tech research

center for the digital economy that

keeps Flanders on the world map. The

gradual integration of both research

centers, and the agreement to preserve

their respective strengths and unique-

ness, will make for a bright future.” n

3

up to 100 participants fromabout 60 to

70 organizations. Participants include

well-known names as well as highly per-

formant local SMEs and start-ups. For

an indication, have a look at the list of participants of last year at page 15.

Have you already registered? Please

do not wait until the very last minutes,

since we start the personalized agenda

planning already 2 weeks in advance.

I am looking forward to see-

ing you at our DSP Valley

B2B matchmaking event

on June 16th in Leuven!

Best regards,

Peter Simkens

Managing Director

DSP Valley

Matchmaking with DSP ValleyOn June 16th, DSP Valley will organize

the next edition of its yearly B2B match-

making event. This event has become a

tradition for the DSP Valley members,

as well as for other interested parties.

It brings together businesses from the

whole value chain in smart electronic

systems, from the technology suppliers

in smart connectivity, smart vision and

smart localization, to the system inte-

grators in smart health, smart home and

smart vehicles. Specializations covered

by the technology providers include

chipdesign for ultra low power, analog

and mixed signal, RF front-ends and

sensors, all very crucial for developing

new Internet-of-Things applications.

The B2B matchmaking event is a full day

event, with 4 blocks of 3 one-on-one

meetings of 30 minutes each, accord-

ing to your own meeting wishes and

according to a pre-planned personal-

ized agenda. Your own preselection of

Pre

fac

e

meeting partners garantees a very high

level of relevance for the developmentof

your business. During the matchmaking

sessions, there are no other alternative

activities, which also garantees that your

meeting partner will be 100% available.

This DSP Valley signature event is also

promoted as one of our flagship events,

open for internationalparticipation. It

is also promoted by our cluster part-

ners from the Silicon Europe Alliance,

the cooperation between 12 leading

European semiconductor and electronics

clusters from Austria, Germany, Greece,

France, Italy, Ireland, the Netherlands,

Spain and the UK. As such, the DSP

Valley matchmaking event is an excel-

lent inter-cluster matchmaking oppor-

tunity to meet with like-minded compa-

nies from our European partner clusters.

Also this year’s event promises to

become very valuable: we are expecting

2newsletter

The Live Editor includes results together

with the code that produced them

to accelerate exploratory programming

and analysis. Add equations, imag-

es, hyperlinks, and formatted text to

enhance your narrative.

MathWorks introduced Release 2016a

(R2016a). This release includes the

MATLAB Live Editor, which offers the

ability to write, run, and modify code

in a single interactive environment to

accelerate exploratory analysis, and App

Designer, an environment that simpli-

fies the process of building MATLAB

apps. R2016a also includes a number of

new features in Simulink to help speed

model development and simulation, as

well as updates and bug fixes to and all

other products.

The Live Editor offers a new way to cre-

ate, edit, and run MATLAB code. Results

and graphics are displayed together with

the code that produced them in a single

interactive environment, speeding explor-

atory programming and analysis. Now,

MathWorks Announces Release 2016a of the MATLAB and Simulink Product Families Introduces major new updates to speed working and collaborating with MATLAB

scientists and engineers can add format-

ted text, mathematical equations, images,

and hyperlinks to create an interactive

narrative that can be shared with others.

App Designer provides an enhanced

design environment and UI component

set for building MATLAB apps. It inte-

grates the two primary tasks of creating

an interactive application – laying out

the visual components, and program-

ming the behavior of the app. The gen-

erated code is object-oriented, which

makes it easier to share data between

the different elements of the app, and

the compact structure makes it easier to

understand and maintain.

Read more here:

mathworks.nl/company/newsroom

R2016a: mathworks.nl/ products/new_

products/latest_features.html n

4

Matchmaking with DSP Valley

I N T H E S P O T L I G H T S

Cable and TV Operators are fac-

ing increasing competition in their

core business. Traditional TV is being

replaced by streaming. Over-the-top

programming from companies like

Netflix and Amazon Prime are remov-

ing much of the demand for entertain-

ment content delivered by the cable

companies, reducing subscribers and

overall revenues. This evolution in cus-

tomer behavior is motivating operators

to find new services and the answer

could be Smart Home services.

There is a great deal of interest in the

Smart Home and IoT. Solution provid-

ers and tech companies see this as a

potential trillion dollars a year indus-

try. This demand for smart services

provides a wonderful opportunity for

cable TV operators who need new rev-

enue services to replace the reduction

of income from subscriptions.

Operators have a tremendous custom-

er base. They have the systems in place

for marketing, billing and customer

support. Large operators are already

rolling out Smart Home services like

home security and environmental con-

trol on a limited basis. However, there

is a much bigger opportunity waiting

that is just starting to emerge.

Family@Home could be the answerFamily@Home services bring in a Smart

Home Butler that helps the family live

their lives securely, more efficiently

and more comfortable. More than just

a network of web connected devices,

this is an entire intelligent service that

combines inputs from a variety of sens-

ing and input devices in a house and

enables easy control of most of the

home systems and appliances.

Sensors provide data to the cloud

regarding the home’s environment as

well as the whereabouts of the mem-

bers of the household. This data is

uploaded to the algorithm in the cloud

and analyzed to create behavior pat-

terns so that the system actually learns

how the family lives – who is usually in

the house and when.

If the kids usually get home from

school at 4pm, and the system senses

that people are entering the home at

11am, it recognizes the anomaly and

can send an alert to the parents. If

the system knows that everybody usu-

ally is out of the home by 8am, and it

recognizes that doors have been left

unlocked, it can automatically lock

them. If the heating has been left on

and the home is empty, the Family@

Home system turns it off, improving

energy efficiency.

Greenpeak - Smart Home Services – A window of opportunity for Operator success

How Family@Home works

These kinds of family management

solutions could be installed and main-

tained by the residents themselves.

However, some would prefer that a

knowledgeable third party comes in

and handles installation. Service provid-

ers who already have a presence in the

home are ideally suited to handle this.

As the operators already have a billing

relationship with the household these

additional services would be basically

another item on their monthly bill.

The Smart Home is a solution that was

seemingly designed for operators to

sell. There is a window of opportunity –

smart operators are recognizing it and

are ready to move into this space. n

5

2newsletter

How do you translate an artistic vision

into a technical implementation?

That’s the main challenge Fourtress, an

organization for embedded software

services, has been tackling throughout

the EEG kiss project. “It has been very

motivating to interact with artists, who

have a different focus than our aver-

age clients,” says Fourtress program-

mer Tom Hilgeman. “Normally, our

clients have a lot of technical know-

how themselves and specific demands

regarding the implementation of our

solutions. The artists were much more

focused on the desired outcome and

we had more freedom and a more

pronounced advisory role regarding

the technical choices that needed to

be made.“

Tom got involved in the very beginning

of the project and – after a period of

working for a Fourtress client – got

reconnected almost a year later. He

was happily surprised by the progress

that was made. “I remember in the

beginning we were tackling the very

basics, such as getting a proper read-

out of the raw EEG data from the

headset. Less than one year later, we

have implemented a complete plat-

form in Python code with various fil-

ters and adjustable for multiple sensor

types. On top of that, we built an

engine in C++ code that runs the visual

and audio feedback of the EEG kiss.”

What started as ‘a nice idea’ related

to the 15th anniversary of Fourtress,

turned into a full-scale project. Douwe

Gerritsen got assigned as account man-

ager and Fourtress dealt with the EEG

kiss project in the same way as it does

with paying customers. Throughout

the year, at least four programmers

got directly involved, spending an aver-

age of three days a week programming

the EEG kiss.

“A lot of the Fourtress programmers

have creative hobbies themselves.

Apart from the technical challenges in

the project, we got a lot of satisfaction

from the interaction with professional

artists. We are very proud knowing

that the result of our efforts will travel

around the world in the form of an

artistic installation.”

Fourtress - Programming a kissSjors Ruijgrok and Bas Kooiker, the

main programmers on the Fourtress

team, bring up a nice anecdote: “We

used the EEG kiss to exhibit at a techni-

cal conference. The positive responses

were numerous. Only… there are typi-

cally not a lot of couples at this kind of

conferences. At the end, two friends

spontaneously decided to kiss, as they

said, ‘in the name of science’. For us,

it was an eye opener how this artistic

installation triggered people in a very

different way then what we are used

when we present our technologies.”

EEG kiss will have its première in March

2016 in the Belvedere Museum in

Vienna (Austria). With Gustav Klimpt’s

kiss being part of its permanent collec-

tion, artists Karen Lancel and Hermen

Maat couldn’t have dreamt of a more

iconic location.

More information about EEG kiss can

be found on http://www.lancelmaat.

nl/work/e.e.g-kiss/

nAbout FourtressAs a specialist in the field of embedded software, technical automation an app

development, Fourtress supports businesses in need of specific knowledge or

additional capacity. Our experts know how to combine their technical exper-

tise with a service-oriented approach. They know how to approach complex

technological issues of our clients in a human and accessible way. Therefore,

Fourtress always creates a human dimension in technology, for both the client

and end user.

6

I N T H E S P O T L I G H T S

Sensimed receives FDA product approval for its Contact Lens with AnSem ASICSensimed received the marketing clear-

ance of its first-of-kind product, the

SENSIMED Triggerfish®, by the U.S. Food

and Drug Administration (FDA).

The SENSIMED Triggerfish® is a unique

sensor-embedded contact lens based

system that Sensimed developed with

the aim to improve the management

of glaucoma. AnSem, Europe’s leading

ASIC design and Turnkey solutions pro-

vider designed the fully integrated sensor

and telemetry system on an ASIC and is

providing the ASIC in volume production

to Sensimed.

The Triggerfish® provides a wireless auto-

mated recording of continuous ocular

dimensional changes over the course of

24 hours. This first-of-a-kind measure-

ment parameter whilst, closely correlat-

ed with intra-ocular pressure (IOP) is a

unique measure in itself. A recent study(1)

published in Ophthalmology linked this

unique continuous volumetric eye meas-

urement to glaucoma disease progres-

sion and concluded that the SENSIMED

Triggerfish® “may be useful in detecting

eyes at higher risk of glaucoma progres-

sion while receiving treatment”.

The FDA reviewed the SENSIMED

Triggerfish® application through the De

Novo Process used for first-of-a-kind tech-

nologies that are not substantially equiva-

lent to an already marketed device. The

SENSIMED Triggerfish® was classified in

the newly created category entitled Diurnal

Pattern Recorder System, defined as:

A diurnal pattern recorder system is

a non-implantable, prescription device

incorporating a telemetric sensor to

detect changes in ocular dimension for

monitoring diurnal patterns of intraocu-

lar pressure (IOP) fluctuations.

The device has been approved with the

following indication:

The SENSIMED Triggerfish® is a pre-

scription device indicated to detect the

peak patterns of variation in intraocular

About AnSemAnSem is Europe’s leading fabless

analog ASIC design service compa-

ny, designing and delivering state-

of-the-art analog, RF and mixed-sig-

nal integrated circuits to customers

worldwide. Founded in 1998 and

based in Leuven, Belgium, AnSem

specializes in the development of

advanced integrated circuits for

wired and wireless data transmis-

sion, sensor data acquisition, ultra-

low power and high voltage appli-

cations. AnSem is ISO 9001 certified

and is a proven and solid develop-

ment partner for ambitious and

visionary customers, reaching for

leadership in global markets.

To find out more, please visit the

AnSem website at www.ansem.com

About SensimedFROM DEVICE TO KNOWLEDGE -- Sensimed AG, a Swiss company, has devel-

oped a unique non-invasive soft contact lens-based solution, the SENSIMED

Triggerfish®, with the aim of revolutionizing glaucoma management by provid-

ing an automated recording of continuous ocular dimensional change over 24

hours. The Company is currently expanding the knowledge of how this individual

data can best be used in the clinical setting to deliver customized treatment. The

24 hour profiles are being centralized on a registry together with patient and

treatment information.

The data are analyzed and modeled on an ongoing basis in an attempt to identi-

fying pathological patterns that can be used to differentiate between indications,

personalize treatment and assess efficacy following treatment. The Company is

directly positioned at the convergence between devices, treatment and informa-

tion. Sensimed believes that with this global knowledge based approach we will

be able to provide valuable insights that will allow ophthalmologists to better

understand and treat glaucoma.

For further information about Sensimed see: www.sensimed.ch

pressure over a maximum period of 24

hours to identify the window of time to

measure intraocular pressure by conven-

tional clinical methods. The SENSIMED

Triggerfish® is indicated for patients 22

years of age and older.

William Maisel, M.D., M.P.H., acting

director of the Office of Device Evaluation

in the FDA’s Center for Devices and

Radiological Health commented in their

official release: “The Triggerfish gives the

clinician 24-hour continuous monitoring

of changes in IOP patterns that otherwise

could not be obtained”. He added: “This

information can help determine the most

critical time of day for the clinician to

measure the patient’s IOP.”

“We are delighted to have worked closely

with FDA on this De Novo application and

to have gained approval for this first-of-a-

kind contact lens-based sensing device in

the USA”, said David Bailey, the CEO of

Sensimed. “There is a very strong inter-

est within the ophthalmic community for

the whole concept of contact-lens based

sensing and we are extremely proud to

have created and developed the first ever

product approved in this category.” n

(1) Visual Field Change and 24-Hour IOP-Related Profile with a Contact Lens Sensor in Treated Glaucoma Patients, De Moraes C. G. et al. – Ophthalmology, in Press

7

2newsletter

The Silicon Europe Alliance is an alliance

of Europe´s leading micro- and nanoelec-

tronics (MNE) clusters. This association

is welcoming European MNE and semi-

conductor clusters and currently unites

12 European MNE clusters (from France,

Germany, Spain,… etc) with about 2,000

cluster members (see picture).

Peter Simkens,

Managing Director of

DSP Valley, is chairman

of the Silicon Europe

Alliance in 2016.

The Silicon Europe Joint Action Plan

describes the agreed actions to be taken by

the Silicon Europe Alliance in order to sup-

port the growth and success of European

innovation in micro- and nanoelectronics,

based on inter-cluster cooperation.

Five strategic themes• Knowledge and Technology Transfer –

Clusters support exchange throughout

Europe

• Smart Specialization – R&D along the

regional strongholds and markets

• SME Funding – Clusters liaise SMEs to

sources of private and public capital

• International Business Development –

Increase international visibility and con-

sequently detect and create opportuni-

ties for the (SME) members

• Promotion of Micro- and Nanoelectronics

– Communicate at large the indispensa-

ble role as key enabling technology in

today’s and future society

Internationalization initiativeTo support internationalization and

increase the international visibility of the

Silicon Europe Cluster, the ‘Silicon Europe

Worldwide’ initiative has been launched.

Silicon Europe Worldwide is primarily

meant to strengthen the international

impact (beyond Europe) of the cross-

regional ecosystem created by the clus-

ter partnership. The main objectives are:

1. Support electronics companies, and

more in particular, SMEs, to be pre-

sent in foreign global markets either

for business or partnerships.

2. Attract foreign investment money or

actors missing in Europe’s value chain.

3. Promote the European electronics

industry worldwide.

http://www.silicon-europe.eu/

European Cluster Collaboration Platform

Via Silicon Europe Worldwide, DSP Valley is

part of The European Cluster Collaboration

Platform. This is a service facility aiming

to provide modern collaborative tools to

DSP Valley, partner of the Silicon Europe Alliancecluster organizations. These tools allow

to develop collaboration trans-nationally

(within Europe) and internationally (beyond

Europe), to support the emergence of new

value chains through cross-sectorial coop-

eration, to improve their performance and

increase their – as well as their members’

– competitiveness,…

http://www.clustercollaboration.eu/

Silicon Europe Worldwide awarded by the European Commission Silicon Europe

Worldwide was

awarded with

the “European

Strategic Cluster

Partnership - Going

International (ESCP-

4i)” label. By sign-

ing the ESCP-4i charter, Silicon Europe

Worldwide commited itself to follow

the main principles of the “Cluster Go

International” call. The aim is to support

the internationalization of SME mem-

bers beyond Europe and to contribute

to the European Commission’s objec-

tives to boost growth and investment in

Europe. n

The Silicon Europe Alliance unites 12 European MNE clusters

Silicon Europe Worldwide (the European Semiconductor Cluster Internationalization Project) has received funding from the European Union’s COSME Program (2014-2020).8

I N T H E S P O T L I G H T S

Cisco predicts that more than 50 Billion

devices will be connected to inter-

net by 2020. It is called “Internet of

Things” (IoT). Many wonder how con-

necting your refrigerator to internet

will benefit anyone. But IoT is about

much more than automated shopping

lists. When you combine sensors, actu-

ators, and networked intelligence, the

possibilities are endless. It can boost

productivity, save resources and even

prevent health issues.

Many IoT chips can be made in older,

depreciated fabrication plants (0.25um,

180nm, 130nm) that were top-notch

20 years ago. One would argue that

foundries have covered every aspect of

Electrostatic Discharge (ESD), Electrical

Overstress (EOS) and Latch-up in these

mature processes long ago.

However we learned, by supporting

innovative semiconductor startups,

that many of the applications in IoT

require non-standard on-chip ESD pro-

tection clamps.

1) Non-standard signal voltagesSeveral IoT systems include sensor

interfaces with distinctive signal con-

ditions (5V or even 20V), beyond the

typical General Purpose I/O (GPIO)

interfaces provided by the foundry.

Similarly, small signals (order of a few

mV or mA) captured by sensors for

motion detection and touch remain

hidden in the noise or are lost due to

leakage from GPIOs.

2) Low leakage requirementA lot of the IoT applications run on

a battery or even harvest energy.

Designers move heaven and earth to

reduce the leakage of the functional

circuits. Foundries on their end pro-

vide special low-power process options

to reduce both standby and dynamic

power. It would be unwise to nullify

all that work through the use of leaky

ESD clamps.

3) Sub-systems are powered downTo further reduce the leakage only

a small part of the system is awake

all the time. All the other circuits are

turned off unless required. Traditional

ESD protection can ruin the efforts

when signals applied on the I/O cir-

cuits power-up a functional block not

required at that time.

4) Wireless interfacesEvery system needs to communicate.

Therefore wireless interfaces can be

found on all of the IoT systems. This

requires on-chip ESD protection with

low parasitic capacitance.

5 reasons why IoT design needs custom ESD protection - Sofics5) System level protection, on the chipA lot of the innovative systems are

meant to be low-cost and mobile and

also this relates to ESD. To reduce the

size and the Bill of Materials (BOM),

system designers remove board level

ESD protection blocks from the mini-

Printed Circuit Boards (PCB). 20

years ago, such Transient Voltage

Suppressors (TVS) devices were added

to protect ICs against ESD stress during

the actual use of products. Without

such TVS protection and due to the

shorter PCB traces Integrated Circuits

are now stressed with more severe ESD

events like IEC 61000-4-2. Moreover,

the probability of ESD-stress is much

higher in those mobile systems as they

are operated in so-called harsh envi-

ronments.

Clearly, IC designers need to think

about the ESD protection strategy for

their IoT system. It is wise to rely on

silicon proven concepts to speed up

market introduction.

n

9

2newsletter

Connect Group has appointed Jeroen

Tuik as its new Chief Executive Officer

(CEO) as of 1 May 2016. A 43 year old

Dutchman, Jeroen Tuik has gathered a

wealth of management experience in

the electronics subcontracting world

in the course of his career, inter alia in

management positions at Benchmark

and Pemstar, two companies operating

in the same sector as Connect Group.

In April 2015, Flor Peersman, the com-

pany’s Chief Operating Officer, was

appointed CEO ad interim. With the

appointment of Jeroen Tuik as CEO,

the management team is back to full

strength, meaning that Flor Peersman

can now fully focus on operations in his

role as COO.

Jeroen Tuik: “I greatly look forward to

joining the Connect Group manage-

ment team. Though the company is still

facing major challenges, I have great

belief in its capabilities and wish to

make my contribution to its success.”

Connect Group wishes Jeroen Tuik lots

of success in his new position. n

A warm welcome for Jeroen Tuik as the new CEO of Connect Group

About Connect Group Connect Group is a leading certified supplier of technology, production systems,

printed circuit boards and cable assembly services for industry. Connect Group

develops products to user specifications from the concept stage onwards with

optimal production, price and quality results. Connect Group references include

Alstom, Atlas Copco, Faiveley, Transics, Nedap, Fabricom and Atos. The company

currently employs around 1,500 people in various facilities in Europe.

About ICsenseICsense is Europe’s premier IC design

company. ICsense’s core business is

ASIC design and supply and custom

IC design services. The company

is active in automotive, medical,

industrial and consumer develop-

ments compliant with ISO26262,

ISO13485, IEC61508 and ISO9001.

ICsense has the largest fab-inde-

pendent European design group

with world-class expertise in ana-

log, mixed-signal and high-voltage

IC design. The company supplies

high quality, cost-efficient custom

ASIC solutions.

Last month, ICsense launched its fresh

looking new website (check it out at

www.icsense.com). Since the last update

in 2011, the mobile traffic has increased

by a factor of 5 and the number of visi-

tors to icsense.com has almost doubled.

“On our new website, we now have

a much clearer segmentation between

the 2 cooperation models “ASIC design

& supply” and “IC design services”.

The needs of our customers are dif-

ferent and have been addressed with

specific use cases to illustrate ICsense’s

expertise,” explains Jeroen Van Ham,

Sales & Marketing Manager at ICsense,

ICsense has a new website

Jeroen Tuik

“The biggest change is that we included

tailored pages for the 4 markets we

serve. These pages contain plenty of

ASIC examples in medical, automotive,

consumer and industrial to help visitors

grasp the specific challenges in these

areas.” n

I N T H E S P O T L I G H T S

10

E M B E D D E D C O R N E R

A warm welcome for Jeroen Tuik as the new CEO of Connect Group

New picoTCP solution – Altran Intelligent Systems

During the Embedded World exhibition,

which took place from 23 to 25 February

in Nuerenberg, Altran Intelligent Systems

premiered with 6LoWPAN in its well-

known open source picoTCP product.

The leading international fair for embed-

ded systems showed the latest feature

of picoTCP, called 6LoWPAN. Altran

believes 6LoWPAN is a very important

key component to connect super small

and very low power, wireless devices to

the Internet of Things (IoT).

Demos of 6LoWPAN nodes showed visi-

tors the possibility to connect long living;

battery operated embedded devices to

standard TCP/IP networks and the inter-

net. Embedded software developers can

simply reuse their TCP/IP socket program-

ming skills and picoTCP handles all the

low level 6LoWPAN communications.

Because picoTCP implements 6LowPAN

meshing, devices can dynamically set up

and reconfigure their own networks.

Altran Intelligent Systems considers

products like picoTCP as strategic assets

in its augmented value services strategy,

in that it allows Altran engineers to

implement TCP/IP based solutions faster

and with higher reliability. picoTCP was

built by Altran’s embedded software

engineers, using Altran’s know-how in

software engineering and quality assur-

ance. It was built out of a need to have

fully optimized and RFC-complete TCP/

IP stack for its projects with custom-

ers. The result is a highly portable and

completely modular TCP/IP stack for

embedded devices with the highest

quality standards. This is done through

techniques like continuous integration,

static & dynamic code analysis, auto-

mated testing, etc.

picoTCP has been open sourced on

Github.

More information can be found on

http://www.picotcp.com n

From February 23 ‘till

February 25 2016,

the German city of

Nuerenberg was

again the center of

the smarter world,

the Embedded World. With over 30.000

visitors and almost a thousand exhibitors

from 38 different countries, this trade

fair is becoming THE event to attend in

the field of embedded systems.

DSP Valley was also present, this year

for the 11th time in a row, with a group

booth. 10 DSP Valley members were

co-exhibitor on the booth whilst some

other members had a booth of their

own. Barco Silex, AcQ Inducom, BlueICe,

Altran, AnSem, Easics, 4DSP, Emweb,

imec and the project consortium of

CLINES took care of the visitors at the

DSP Valley booth. NXP Semiconductors,

ICSense, Sigasi, Mathworks, EBV,

Arrow, Avnet-Silica and many others

had their own booth.

A walk through the different halls gave

inspiration for a description of some

of the highlights of the fair: a novelty

in this years’ edition was the specific

focus on Security and Safety. Issues like:

“How do I protect my embedded system

from an attack ?”, “How do I design

tamper-proof software?”,”What to do

against piracy?”, … were tackled in a

specific area of the exhibition grounds.

In this area one could meet the com-

panies with specific expertise in this

domain, but it was also meant to be

a recognition of the fact that security

technologies are increasingly important

for embedded technology.

The most important topic however,

being the topic everyone talked about,

the topic that was at least mentioned

three times on almost every booth this

year was IoT – Internet of Things. Be

it IoT or Industry 4.0 or a “Connected

World”, every booth had at least one

desk with an info stand on connected

devices and cloud applications. Some

companies provide small, low-end but

connected sensor devices while other

organizations focus on the software or

the cloud services. Most of the times

sensors are built in some kind of a sen-

sor module where, next to the sensor

itself, there is also some logic or process-

ing unit to do the first data processing.

A communication chip (Zigbee, Sigfox,

LoRa, Wifi, BLE, ….) often completes the

sensing module.

One of the companies that was omni-

present with their solution for the IoT

was Microsoft. They presented and pro-

moted their Windows 10 IoT Operating

System.

IoT, or whatever other name you give it,

is definitely here to stay!

n

Embedded World 2015 ... It’s a smarter world

11

2newsletterE M B E D D E D C O R N E R

Meet the DragonBoard 410c from Arrow and Qualcomm

Due to increasingly complex prod-

ucts and the demand for even faster

design cycles, it’s becoming increas-

ingly important for embedded develop-

ers to select the right horse. Thanks

to the availability of hardware and

software, community boards, like the

Dragonboard 410c, are often used as

proof of concept or even for the first

prototype series.

Recently Arrow Electronics and

Qualcomm developed the Dragonboard

410c based on the Snapdragon 410

CPU of Qualcomm, one of the first

64-bit ARMv8 processors, which is also

suitable for industrial applications, in

addition to other two processor of

Qualcomm (Snapdragon 600 and the

Snapdragon 820) which are also open

for the industrial market.

This DragonBoard 410c, is smaller than

a standard playing card, packs a lot in

a tine footprint, including a Quad-core

ARM® Cortex™ A53 at up to 1.2GHz

Snapdragon 410 processor, 1GB RAM,

8GB SanDisk e.MMC storage, on

board WLAN, GPS and Bluetooth. It is

designed to support feature-rich func-

tionality, including multimedia, with

the Qualcomm® Adreno™ 306 GPU,

integrated ISP with up to 13 MP cam-

era support, and 1080p HD video play-

back and capture with H.264 (AVC).

The Snapdragon, made in a 28nm

low-power process, offers a good bal-

ance between performance and power

efficiency.

Due to the origin of this processor

generation, from the mobile phone

market, Android support is excellent.

In addition to Android and Linux,

Dragonboard provides 410c as one of

the first fully supported platform for

Windows 10 IoT. All necessary files and

BSP can be downloaded for free from

the Microsoft site. Especially the video

drivers are fully hardware accelerated

and deliver significantly better per-

formance than others solutions, with

simultaneous design safety if the prod-

uct is or has to be converted into an

industrially compatible design.

The Dragonboard 410c is based on

96Boards™ (www.96boards.org) spec-

ification, known as the a 32-bit and

64-bit ARM® Open Platform hosted by

Linaro™ with the intension to serve the

software maker and embedded OEM

communities.

A great advantage over other communi-

ty boards is there are the Dragonboard

alternatives available, where all the

challenges that arise in the indus-

trial environment are offset. These

SOM solutions have extended tem-

perature range capabilities and offer

you a great possibility to make your

application production ready. Solutions

like Open-Q 410 (Intrynsic), Variscite

DART-SD410, Inforce 6309 Micro SBC,

Eragon-410 (eInfoChips) and others are

available. And another great advantage

is that these SOM suppliers offer you a

longevity commitment up to 10-years,

as well development boards are avail-

able to get started.

More information and videos about

the Dragonboard 410c can be found

on this link:

https://www.arrow.com/en/campaigns/

the-dragonboard-is-here

n

About Arrow Arrow is a distributor of semiconductor, passive and electro-mechanical compo-

nents and a provider of embedded solutions. Arrow also supports customers with

the offer of reference kits and designs, technical support, technological seminars,

workshops, … .

Arrow is a partner that accompanies customers starting at the design phase and

offers the most suitable components and solutions.

12

Interested in the latest changes in IC

design flow for advanced deep-submi-

cron technology? These two courses

might interest you!

Once a system architecture has been

created, the digital design is expanded

to a lower level to be able to build an

ASIC or program an FPGA . For specific

cases, there are synthesis tools that do

this automatically. Still, many designs

are translated manually to a register

transfer level using a hardware descrip-

tion language such as VHDL.

This course in VHDL and design flow

course offers not only a foundation into

Ever increasing design time, costs and

complexity of SoC/MPSoC has steered

tremendous pressures in time-to-mar-

ket. To ensure a reliable system archi-

tecture for a SoC, we need much more

rigorous methodology in architecture

exploration phase running many itera-

tive simulations with a quick turnaround

time. The real value of using TLM is

hardware software co-design and avail-

ability of HW platform at an early stage

of design cycle for SW development.

synthesizable code for the design but

also in test bench coding. It is targeted

at engineers who are new to VHDL.

Good coding practices will be learned

by way of labs and exercises. In addition,

the course also introduces the partici-

pants to the other important frontend

tools in the design flow.

Some specific focus topics of the design

flow in the course:

• We will show how test logic is added

during synthesis and how test pat-

terns are created. These are needed to

be able to identify defective dies after

processing.

• Participants will learn how to add

The vital goal of this methodology is

in offering a good balanced trade-off

between speed and accuracy.

The Open source SystemC C++ class

library offers a useful intermediate

abstraction between a system on chip

specification and synthesizable RTL. And

Transaction Level Modeling (TLM) is a

methodology based on system abstrac-

tion, bringing software and hardware

closer through a common interface.

VHDL Language and design flow

Transaction Level Modeling (TLM 2.0) using SystemC

Imec - Update on latest changes in IC design flow

June 20-24, 2016Imec, Leuven, Belgium

June 27-28, 2016 & 27-28 October 2016Imec, Leuven, Belgium

www.imecacademy.be

Check the Training Calendar

www.imecacademy.be

Check the Training Calendar

low-power structures during synthe-

sis. We’ll also show tools for initial

power estimation. For many ASICs,

power consumption is essential, and

taking this into account will involve

e.g. adding clock gates.

• We also teach how to add a formal

logic equivalence check as part of

the standard flow. The manufacturing

cost of an ASIC is very high - especially

for the newer technology nodes. So

we need to be absolutely sure that

the functionality described in the RTL

code is implemented correctly on the

ASIC and no bugs are inserted due

to synthesis or low-power and test

modifications. n

This course will introduce participants

to the OSCI TLM-2.0 standard. TML 2.0

delivers a set of core interfaces, the global

quantum, the initiator/target sockets, the

generic payload and base protocol, and

the utilities for effective system modeling

saving the simulation time with abstract-

ed timing accuracy. With examples and

hands-on training, we’ll give the par-

ticipant a feel of the complexity and the

appropriateness of the different modeling

styles for various use cases. n

U P C O M I N G E V E N T S

Since a few years, GPUs are exploited

to accelerate compute-intensive algo-

rithms and applications. However, their

enormous computing power comes at

the expense of a new programming

model which allows the expression of

fine-grain parallelism. OpenCL is put

forward as a standard extension to

C for programming GPUs, but also

multi- and manycores. The Personal

Super Computing Competence Center

of the VUB organizes a session on GPU

programming which includes a 1-day

GPU Programming: Introduction and Hands-on Training OpenCL

May 24 – 26, 2016VUB Campus, Etterbeek, Brussels, Belgium

www.personalsupercomputing.org

introduction and, optionally, 2 days of

hands-on practical exercises and demos.

More information:

www.personalsupercomputing.org

or jan.lemeire@vub.ac.be

n

13

DSP Valley gladly invites

you to join a mission to

Taiwan to attend the

European Innovation

Week. The European

Innovation Week in Taiwan is co-organ-

ized by Silicon Europe Worldwide. The

European Innovation Week offers you a

broad program including many oppor-

tunities to get acquainted with a mani-

fold of Taiwanese companies, institutes

and organizations. Computex, the larg-

est Asian ICT fair and counterpart of the

the handling strength is required also for

low volume production applications. On

the other hand, users of adhesive bond-

ing technologies require more and more

“de-bonding on demand” functionalities

for end-of-life recycling, but especially for

the repair/replacement of components

during the life-time of the system.

The new European collective research

project “Fast and Stable Adhesive

Curing with Debonding Option” aims at

CES, will be the venue for the event.

• Promote your company in Taiwan, an

IoT hub for the rest of Asia

• Attend COMPUTEX Taipei, the big-

gest ICT Fair in Asia, attracting more

than 1,700 international exhibitors

covering the whole ICT supply chain

from Consumer Electronics to IOT

Call for industrial interest - European collective research projectFast and Stable Adhesive Curing with Debonding Option – Flanders Make

European Innovation Week – Taiwan

May 30 – June 4, 2016Taipei, Taiwan

http://dspvalley.com/en/events/522/

building-up the required knowledge for

developing and optimising the applica-

tion of high-frequency field technolo-

gies to speed-up the curing step (of

heat-curing adhesives) and to enable

weakening of the bond (de-bonding)

when required (end-of-life and repair).

Interested to receive more information

or to join this project?

Please contact Stijn Pauwels:

stijn.pauwels@flandersmake.be. n

• Participate in B2B, B2C and C2C

Matchmaking Events bringing

Taiwanese and European companies,

clusters, institutes and agencies together

• Attend Workshops where you can pre-

sent your digital technologies enabling

innovative solutions for Smart Health,

Smart Mobility or Smart Industries and

learn about the latest developments in

5G and nanoelectronics.

Questions? Please contact

Johan.lecocq@dspvalley.com n

Register for this event: https://www.b2match.eu/eu-taiwan-2016

2newsletter

The curing time is often a bottleneck for

the use of adhesive bonding technology,

especially for high volume production

applications but not only. For instance,

when a bonded component needs to

be transported to other areas of the

production site, a fast reach of at least

14

June 16, 2016 Belgium, Sportoase Leuven

Business-to-Business Forum 2016

Valley welcomes you on the yearly

B2B Forum. The venue for this top-

notch matchmaking event will again be

Sportoase in the city center of Leuven,

Belgium.

An entire day filled with interesting

1-on-1 meetings with some of the lead-

ing executives of the embedded indus-

try in the BeNeLux and Europe, with a

pre-screening guaranteeing a high level

of relevance for your business develop-

ment. This very efficient format allows

you to have 10 to 12 high-quality meet-

ings in just 1 day.

The technology focus of this matchmak-

ing event will be on:

Smart Electronic Systems

• Design and development of embedded

technology (hardware and software)

• Design of Signal Processing Systems

(audio, image, video)

• Design tools and methodologies

• ...

Application Domains

• Smart Health

• Smart Home / Smart Cities

• Smart Vehicles

• Smart Localization

• ...

4DSP

Achilles Design

ACQ Inducom

Aimvalley

Alpwise

Altran

AnSem

Ansys

ANT Micro

Arrow Electronics

Atlas neuroengineering

Barco Silex

BlueICe

Boston Scientific

Cicor AMS

Comate

Connect Group

Dekimo

Deltatec

Dolphin Integration

DVC Machinevision

Easics

EBV Elektronik

Elsys

Embility

Emweb

Essensium-Mind

Eurocircuits

Eurotronics

Exmore

Flanders Bio

Grammer EiA

Green Hills Software

HighTech NL

HM International

Hybrio Design

imec

iMinds

Impulse Response

KUL - LICT

Lacroix Electronics

Luperco

Lysitech

Made

MangoGem

Microlease

Microtron

Minalogic

MinDCet

Mu Technologies

Nalys Group

Newtec-MCC

NovelIC

Phaer

PiliPili

PragmaDev

Premium Sound Solutions

Qspin

Quad Industries

REC Global

RSScan

Serma Technologies

SharedEDA

Silica

Smart Media

Synopsys Belgium

Taipro Engineering

Televic

Test&Measurement Solutions

TP Vision

TU Delft

V.O. Patents and Trademarks

Verhaert

VITO

Yazzoom

List of participants of last year

REGISTER now on our website:http://www.dspvalley.com/en/events/481/

U P C O M I N G E V E N T S

REGISTERNOW

15

This publication has been realized with the support of these organizations.

2newsletterC O N T A C T I N F O R M A T I O N

Imec and Vrije Universiteit Brussel Present Small, Low-Cost and Low-Power Chip for multi-gigabit 60GHz Communication • p. 1Mr. Kris Hermus, Innovation Program Manager Flanders, imec • Tel. +32 16 28 15 06

www.imec.be • Kris.Hermus@imec.be

Averna Acquires Leading European Company Test & Measurement Solutions • p. 2Mrs. Liesbeth Boels, Communication Manager Test & Measurement Solutions • Tel. +32 11 35 25 48

www.tm-solutions.eu • Liesbeth.Boels@tm-solutions.eu

Mrs. Isabelle Pilon, Marketing Specialist Averna • Tel. +1 514 842 7577

www.averna.com • isabelle.pilon@averna.com

Imec and iMinds to Merge and Create High-Tech Research Center Driving the Digital Economy • p. 2Mr. Kris Hermus, Innovation Program Manager Flanders, imec • Tel. +32 16 28 15 06

www.imec.be • Kris.Hermus@imec.be

MathWorks Announces Release 2016a of the MATLAB and Simulink Product Families • p. 4Mrs. Cindy Bouwels, Marketing Mathworks • Tel. +31 40 215 6700

cindy.bouwels@mathworks.nl • Http://www.mathworks.nl

Greenpeak - Smart Home Services – A window of opportunity for Operator success • p. 5Mr. Cees Links, CEO of GreenPeak • Tel. +32 52 45 87 20

www.greenpeak.com • clinks@greenpeak.com

Fourtress - Programming a kiss • p. 6Mr. Bart van den Broek, Commercieel Manager Fourtress • Tel. +31 40 266 10 80

www.fourtress.nl • bart.van.den.broek@fourtress.nl

Sensimed receives FDA product approval for its Contact Lens with AnSem ASIC • p. 7Mr. Joan Ceuterick, Business Development Manager AnSem • Tel. +32 16 38 65 07

www.ansem.com • joan.ceuterick@ansem.com

DSP Valley, partner of the Silicon Europe Alliance • p. 8Mr. Johan Lecocq, Project Manager DSP Valley • Tel. +32 16 21 14 10

www.dspvalley.com • johan.lecocq@dspvalley.com

5 reasons why IoT design needs custom ESD protection – Sofics • p. 9Mr. Bart Keppens, Director Marketing, Sofics • Tel.: +32 59 27 59 15

http://www.sofics.com • bkeppens@sofics.com

A warm welcome for Jeroen Tuik as the new CEO of Connect Group • p. 10Mr. Koen Bonny, Business Unit Manager Connect Group • Tel. +32 16 61 89 20

www.connectgroup.com • K.Bonny@connectgroup.com

ICsense has a new website • p. 10Mr. Jeroen Van Ham, Sales and Marketing Manager ICsense • Tel. +32 16 58 97 21

www.icsense.com • vanham@icsense.com

Embedded World 2015 ... It’s a smarter world • p. 11Mr. Björn Van de Vondel, Project Manager DSP Valley • Tel. +32 16 24 14 42

www.dspvalley.com • bjorn.vandevondel@dspvalley.com

New picoTCP solution – Altran Intelligent Systems • p. 11Mrs. Lieze D’hondt, Marketing & Communications Intelligent Systems/Altran • Tel. +32 9 277 77 37

www.altran.be • lieze.dhondt@altran.com

Meet the DragonBoard 410c from Arrow and Qualcomm • p. 12Mr. Armin Faems, Specialist Field Application Engineer ARROW Electronics • Tel. +32 2 719 71 58

www.arrow.com / www.arroweurope.com • afaems@arroweurope.com

Contact Information

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arks or registered trademarks m

entioned in this newsletter are the intellectual property of their respective ow

ners.

16