BLD335x Isolated IGBT Driver · 2019-08-21 · BLD335x datasheet 上海贝岭股份有限公司 2 /...

BLD335x datasheet

上海贝岭股份有限公司 1 / 14 V0.1

上海市宜山路 810 号 021-24261000

上海贝岭

BLD335x Isolated IGBT

Driver

Datasheet

Document No: HVD335x_DS Rev0.1

2019-7-2

BLD335x datasheet


上海市宜山路 810 号 021-24261000

1 Features

- Single-channel 1200 V isolated driver

optimized for industrial and automotive

applications

- 2.5 A peak output current

- 5 kVrms input to output isolated voltage

- Higher than 50 V/ns dv/dt immunity

- Less than 100 nS propagation delay

- Less than 40 nS pulse width distortion

- Integrated IGBT functions:

o IGBT soft turn-off

o Desaturation detection

o Internal over-temperature protection

o Active Miller-Current clamp

o Under voltage lockout protection

o Fault sensing/reporting to system controller

(DESAT &UVLO)

- TTL compatible inputs

- Automotive temperate range (BLD3352)

- Bipolar or unipolar supply operation

- Wide 30V output supply range

- Low quiescent current (15 mA)

- UL1577 certified

- DIN EN/IEC 60747-5-5

2 Application

- AC/DC motor drives

- Air-conditioning inverters

- Welding/plasma equipment

- Uninterruptible power supplies

- Battery charging systems

- Automotive OBC and traction inverters

- Auxiliary inverters for HEV and EV

- PV solar inverters and optimizers

Pri

mar

y L

og

ic

Seco

nd

ary

Lo

gic

VO

SSD/CLAMP

DESAT

VCC2

VE

VEE2

nFAULT

nUVLO

VEE1

VCC1

AN_IP

CA_IN

InputStage

PowerSupply

OutputStage

Desat

PowerSupply

OTP Internal

Figure 1-2-1 BLD335x Block diagram

BLD335x datasheet


上海市宜山路 810 号 021-24261000

Content

1 Features ........................................................................................................................................... 2

2 Application ...................................................................................................................................... 2

3 Function Description ....................................................................................................................... 5

3.1 Introduction ......................................................................................................................... 5

3.2 Power supply ....................................................................................................................... 5

3.3 Input & output ..................................................................................................................... 5

3.3.1 Non-Inverting and Inverting Inputs.............................................................................. 5

3.3.2 FAULT ......................................................................................................................... 6

3.3.3 Driver out ..................................................................................................................... 6

3.4 Internal protection function ................................................................................................. 6

3.4.1 Under voltage Lock out (UVLO) ................................................................................. 6

3.4.2 Internal over temperature protection ............................................................................ 6

3.5 External Protection .............................................................................................................. 6

3.5.1 Desaturation Protection ................................................................................................ 6

3.5.2 Active Miller Clamping ............................................................................................... 7

4 Pin description ................................................................................................................................ 8

4.1 Pin list .................................................................................................................................. 8

5 Electrical parameters ....................................................................................................................... 0

5.1 Absolute maximum rating ................................................................................................... 0

5.2 Recommended operating conditions ................................................................................... 0

5.3 Electrical characteristics ...................................................................................................... 1

5.3.1 Power supply ................................................................................................................ 1

5.3.2 Logic input & output .................................................................................................... 1

5.3.3 Gate Driver ................................................................................................................... 2

5.3.4 Active miller clamp ...................................................................................................... 2

5.3.5 Desaturation protection ................................................................................................ 3

5.3.6 Internal over temperature protection ............................................................................ 3

6 Insulation characteristics ................................................................................................................. 3

6.1 Complied with UL1577 ....................................................................................................... 3

7 Application description ................................................................................................................... 4

8 Package information ....................................................................................................................... 4

BLD335x datasheet


上海市宜山路 810 号 021-24261000

Figure 1-2-1 BLD335x Block diagram ............................................................................................................. 2

Figure 7-1 BLD335x application example with bipolar supply ........................................................................... 4

Table- 5-1 Absolute maximum rating ............................................................................................................... 0

Table- 5-2 Recommended operating conditions ................................................................................................. 0

Table- 5-3 Power supply ................................................................................................................................. 1

Table- 5-4 Logic input & output ....................................................................................................................... 1

Table- 5-5 Driver out performance ................................................................................................................... 2

Table- 5-6 Active miller clamp performance ..................................................................................................... 2

Table- 5-7 Desaturation protection performance ................................................................................................ 3

Table- 5-8 Gate driver internal over temperature protection ................................................................................ 3

Table- 6-1 UL1577 related performance ........................................................................................................... 3

BLD335x datasheet


上海市宜山路 810 号 021-24261000

3 Function Description

3.1 Introduction

The BLD335X is a full-featured, galvanic isolated 2.5 A/1200V-rated Gate Driver IC. This single-chip solution

integrates features that improve performance and ensure long-life in harsh environments. It is used for fast-

switching drive and control of the current generation of power IGBT’s, Si MOSFETs, and SiC MOSFETs. The

driver incorporates Belling’s on-chip coreless transformer technology to enable the high transient immunity (>50

V/ns) required in industrial and automotive environments.

The driver works in motor-control, switch mode power supply, PFC, UPS, EV (OBC) charging, industrial pumps,

and traction inverter applications. Its short propagation delay and small timing-skew help achieve optimum

performance at higher switching speeds when compared to conventional driver solutions available in the market. All

logic pins are TTL compatible for easy interface to standard controllers and MCUs.

The BLD335X architecture includes several control features protecting the IGBT in harsh industrial and automotive

environments. Those integrated features include IGBT desaturation sensing with soft-shutdown protection, under-

voltage lockout, active Miller-Current clamping and fault reporting to the system controller.

The device supports bipolar and unipolar supply voltage configurations. In a bipolar configuration, the driver is

typically supplied with voltages of +18 V and -5 V. For unipolar configuration, the driver is typically supplied with

a positive 18 V (max 32 V).

To meet UL isolation, creepage and clearance requirements, the BLD335X is available in a standard SO-16 (wide-

body) package.

3.2 Power supply

The driver BLD335x is designed to support two different supply configurations, bipolar supply and unipolar supply.

In bipolar supply the driver is typically supplied with a positive voltage of 18V at VCC2 and a negative voltage of

-5V at VEE2.

Negative supply prevents a dynamic turn on due to the additional charge which is generated from IGBT input

capacitance times negative supply voltage. If an appropriate negative supply voltage is used, connecting CLAMP to

IGBT gate is redundant and therefore typically not necessary.

For unipolar supply configuration the driver is typically supplied with a positive voltage of 18V at VCC2. Erratically

Dynamic turn on of the IGBT could be prevented with active Miller clamp function, so CLAMP output is directly

connected to IGBT gate.

3.3 Input & output

3.3.1 Non-Inverting and Inverting Inputs

There are two possible input modes to control the IGBT.

1) At non-inverting mode IN+ controls the driver output while IN- is set to low.

BLD335x datasheet


上海市宜山路 810 号 021-24261000

2) At inverting mode IN- controls the driver output while IN+ is set to high. A minimum input pulse width is

defined to filter occasional glitches.

Any glitch on IN+ or IN- shorter than 40ns would be ignored

3.3.2 FAULT

The device has a default open-drain FAULT output. It would be turned LOW when any of the following events

happens

1) IGBT module work in saturation region

2) IGBT driver over temperature

3) High side Pin monitor function indicates error

3.3.3 Driver out

The output driver section provide a rail-to-rail output, it clamps to LOW defaultly. During normal operation,

VOUT driver the external IGBT gate high or LOW according to the IN+/IN-. The driver provides max 2.5A sink

current & 2.5A source current capability.

This driver detects the driver out status, if the IN+/IN- sets the VOUT to be HIGH to enable the IGBT, but the

VOUT has not to be above 8V typically after 1ms, the FAULT PIN at input side would set to be LOW and soft turn

off. When soft turn off, the soft turn off sink current is 1A typically

3.4 Internal protection function

3.4.1 Under voltage Lock out (UVLO)

To ensure correct switching of power devices, Under voltage Lock out function is integrated in both input side chip

& output side chip. If the input power supply VDD_LS is lower than VDD_LSUVLO_L, a turn-off signal is sent to

the output chip before power-down, The IGBT is switched off and the signals at IN+ and IN- are ignored until the

VDD_LS back to higher than VDD_LSUVLO_H

If the input power supply VDD_HS is lower than VDD_HSUVLO_L, The IGBT is switched off and the signals at IN+

and IN- are ignored until the VDD_HS back to higher than VDD_HSUVLO_H

3.4.2 Internal over temperature protection

There are over temperature protection blocks in both input side & output side. Anytime the temperature >150℃，

the chip set below step until the temperature low to 135 ℃

1) the FAULT Pin active

2) block the data from input side to output set

3) set the driver out to LOW

when the temperature lower than 135℃，the FAULT low status would be clean up

3.5 External Protection

3.5.1 Desaturation Protection

The driver has a DESAT input and a de-saturation protection function to monitor the IGBT saturation voltage (VCE).

The DESAT connects to Collector PIN of IGBT by diode & resistor When voltage at DESAT >2V typically, soft turn

off the IGBT module gate, the soft turn off current is 1A typically.

BLD335x datasheet


上海市宜山路 810 号 021-24261000

Should be note that the 2V threshold is not the real de-saturation protection threshold voltage for the system, the de-

saturation protection threshold voltage see at IGBT module side would be set by external resistor network, and a

blanking time set by an external RC circuit When de-saturation protection is activated, the FAULT pin on the low

side should be set to LOW. The propagation delay from desaturation sense to starting soft turn off <150ns max, from

desaturation sense to FAULT LOW <2us max

3.5.2 Active Miller Clamping

When the IGBT is turned off (gate voltage < 2V related to VNEG_HS), there is an active Miller clamp block to

monitor the gate voltage of the of IGBT

The threshold voltage to clamp: 2.1V typically related to VNEG_HS, max 2.4V， the gate voltage would be clamp

to lower than the threshold during VOUT set to be LOW. The Clamping current is 1A typically

BLD335x datasheet


上海市宜山路 810 号 021-24261000

4 Pin description

4.1 Pin list

PIN Name Description

1 VEE1 Low Side(LS) ground return

2 NC No Connect, test PIN

3 VCC1 Low Side(LS) power supply

4 NC NC

5 nUVLO Under voltage Lock-out, open drain active LOW output

6 nFAULT Desaturation Fault, Drain active LOW output

7 AN_IP The AN_IP control signal for the driver output while CA_IN is set to low. The IGBT is

turned on if AN_IP is set to high and CA_IN is set to low, otherwise is turned off.

A minimum pulse width is required to suppress glitches while controlling the IGBT. An

internal pull-down resistor ensures that the IGBT is kept in off-state if terminal AN_IP is left

unconnected.

8 CA_IN Inverting driver input. CA_IN control signal for the driver output while AN_IP is set to high.

The IGBT is turned on if CA_IN is set to low, and is turned off if CA_IN is set to high, while

AN_IP is kept high.

9 VEE2 High Side(HS) negative supply voltage(Ref. VE）

10 SSD/CLAMP IGBT Gate connection for Clamp and SSD pull down

11 VO Driver output

12 VCC2 High Side(HS) positive supply

13 VE Common (IGBT emitter) output supply voltage

14 DESAT Desaturation sensing input

15 NC No Connect, test PIN

16 VEE2 High Side negative supply voltage(Ref. VE)

Application note

5 Electrical parameters

5.1 Absolute maximum rating

Note: Absolute maximum ratings are defined as ratings, which when being exceeded may lead to destruction of the integrated circuit.

Unless otherwise noted all parameters refer to VEE1

Table- 5-1 Absolute maximum rating

Parameter Symbol Min Max Unit

input side power supply VDD_LS -0.3 6.5 V

Positive power supply of output side VDD_HS -0.3V 30V V

Negative power supply of output side VNEG_HS -12V 0.3V V

maximum power supply voltage output side

(VDD_HS-VNEG_HS) VMAX_OUT 36 V

Gate driver output VOUT VNEG_HS-

0.3 VMAX_OUT+0.3 V

Gate driver high output maximum current IOUT / 5.5 A

Gate & clamp driver low output maximum

current IOUT / 5.5 A

logic interface at input side VLOGIC -0.3 6.5 V

PIN DESAT voltage VDESAT -0.3 VDD_HS+0.3

PIN CLAMP voltage VCLAMP -0.3 VDD_HS+0.3

PIN IGBT OC_S voltage VOC_S -0.3 VDD_HS+0.3

PIN IGBT TEMP_S voltage VTEMP_S -0.3 VDD_HS+0.3

Junction temperature Tj -40 150 ℃

Storage temperature Ts -40 150 ℃

Power dissipation of input chip PD_IN

Power dissipation of output chip PD_OUT

Thermal resistance (input chip active） RTHJA IN

Thermal resistance (output chip active） RTHJA OUT

ESD capability （Human Body Model） VESD_HBM / 2.5k V

ESD capability （Machine model） VESD_HBM / 200 V

ESD capability (charged device model) VESD_CDM / 500 V

5.2 Recommended operating conditions

Table- 5-2 Recommended operating conditions

Parameter Symbol Min TYP Max Unit

input side power supply VDD_LS 4.5 5 5.5 V

Positive power supply of output side VDD_HS 12 28 24 V

Negative power supply of output side VNEG_HS -12 -5 V

Application Note

1 / 14

5.3 Electrical characteristics

5.3.1 Power supply

Table- 5-3 Power supply

Parameters Symbol MIN TYP MAX Unit Note

input side power supply VDD_LS 4.5 5 5.5 V

Quiescent current of input

side chip IQ_LS 10 mA Note 1)

UVLO threshold input chip VDD_LSUVLO_L 3.5 3.8 V

VDD_LSUVLO_H 4.1 4.3 V

UVLO Hysteresis input chip 0.2 0.3 V

Undershoot noise pulse

width suppression at UVLO 30 us

Positive power of output side VDD_HS 12 18 24 V

Negative power of output

side VNEG_HS -12 -5 0 V

Max output voltage at output

chip (VDD_HS-VNEG_HS) 36 V

Quiescent current of output

chip IQ_HS 6 mA Note 2)

UVLO threshold output chip VDD_HSUVLO_L 9 V

VDD_HSUVLO_H 10 V

UVLO Hysteresis output

chip 0.5 V

Common mode transient

immunity (CMTI) 50 kV/us VCM=1500V

Note

1）Test conditions: VDD_LS=5V, the chip is right ready and driver out of high side is HIGH.

2）Test condition: VDD_HS=18V, VNEG_HS= -5V. the chip is right work and drive out HIGH.

5.3.2 Logic input & output

Table- 5-4 Logic input & output


IN+, IN-, RST Low input

voltage - - 1.5 V

IN+, IN-, RST High input

voltage 3.5 - - V

Application Note

2 / 14

IN-, RST input current

IN+ input current

RDY, FLT Pull up current

Input Pulse suppression 40 ns

Pulse width RST for Resetting

FLT 800 - - ns

FLT low voltage V

RDY low voltage V

Input to output propagation

delay T_PDON 110 150 ns

Input to output propagation

delay distortion T_PDISTO 20 ns

5.3.3 Gate Driver

Table- 5-5 Driver out performance


Active output pulldown voltage VOUTPD - - 2 V

High level output voltage VOUT_H VDD_HS-0.25 V

Low level output voltage VOUT_L VNEG_HS+0.13 V

High level output current IOUT_H 2.5 A

Low level output current IOUT_L 5 A

Low level output current during

Fault condition IOUT_FLT 130 mA

VOUT Rise time T_rise_VO

VOUT fall time T_fall_VO

Threshold to set Out status

Feedback PIN V_OSF 8 V

Time to indicate Low gate

driver output after set HIHG by

input

t_OSF 1 ms

5.3.4 Active miller clamp

Table- 5-6 Active miller clamp performance


Clamp threshold voltage VCLP_TH 1.6 2.1 2.4 V Note 1)

Low level Clamp

current ICLAMP 1 A

Low level clamp voltage VCLP VNEG_HS+0.015 V

Note:

1) Related to VNEG_HS

Application Note

3 / 14

5.3.5 Desaturation protection

Table- 5-7 Desaturation protection performance


DESAT threshold voltage VDESAT 1.9 2 2.1 V Note 1)

DESAT sense to FLT LOW T_DESATFLT - - 2 us

DESAT sense to start turn

off T_DESATOUT - - 150 ns

Note:

1) the 2V threshold is not the real de-saturation protection threshold voltage for the system, the de-

saturation protection threshold voltage see at IGBT module side would be set by external resistor

network, and a blanking time set by an external RC circuit

5.3.6 Internal over temperature protection

Table- 5-8 Gate driver internal over temperature protection


Threshold of over

temperature protection

OT_H 150 ℃

OT_L 135 ℃

Note

1) there are over temperature protection blocks in both input chip & output chip with the same performance

table above

6 Insulation characteristics

6.1 Complied with UL1577

Table- 6-1 UL1577 related performance


Insulation withstand

voltage(1min) VISO_1MIN 3750 Vrms

Insulation withstand

voltage(1sec) VISO_1SEC 5000 Vrms

Note

Application Note

4 / 14

7 Application description

Figure 7-1 BLD335x application example with bipolar supply

8 Package information

TBD

Application Note

5 / 14

BLD335x Isolated IGBT Driver · 2019-08-21 · BLD335x datasheet 上海贝岭股份有限公司 2 /...

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