NDIP Conference

� j o � � �� � J , 17.Jul.2008/

See, http://ndip.in2p3.fr/ for slides

NDIP Conference

❏

• Beaune XX

• 96 3

•

❏ Aix-Les-Bains

•

• 1998 FIFAWorld Cup

❏

• 200

• 58 Talks, 80 Posters

• CCD, SiPM, X-ray, Astro, APD....

• 1/3 SiPM Talk

❏ SiPM

.

SiPM Talk

SiPM Talk

❏

• Optical Crosstalk (3 Talks)

• Radiation Damage (2 Talks)

• ADC (1 Talks)

❏

• SiMPL (SOI@MPI)

• CPTA/Photonique

• SiPM Array

❏ Position Sensitive

• SPAD (Singel Photon Avalanche Diode, 3 Talks)

• Avalanche CCD

❏ Application

• PET ( timing resolution , 4 Talks)

• T2K/Calice (3 Talks)

• ASIC (1 Talk)

Radiation Damage

❏ 2 Talks

• 82 MeV Proton (Y. Musienko)

• Neutron ( )

❏

• Noise, current

•

Y.Musienko’s Summary

Noise Rate

log10(neutron)

Noi

se R

ate

(Hz)

100 µm (∆V=0.9V)

50 µm (∆V=1.4V)

10 5

10 6

10 7

10 8

9 10

PDE

∆V (V)N

/Nre

f

0.5

1

1.5

0.75 1 1.25 1.5 1.75

.

TOF (Timing Resolution)

❏ TOF PET

• ∆x = 0.5c∆t

• contrast

• LYSO or LaBr3 + SiPM

⋄ 3 × 3 × 10 mm2 × 16

❏ Timing Resolution Measurement

• MPPC

• photon/511 keV

• Best Result 250 ps FWHM

• 1p.e. σ =100ps (LASER)

Setup

by R. Vinke

by C.L. Kim

.

ADC (F. Retiere)

❏ MPPC ADC

❏

• Afterpulse Rate ( )

• Crosstalk Rate

Afterpulse

.

Optical Corsstalk

❏ GAPD spectrum spectrum

A.Ingargiola R. Mirzoyan

❏ several ×10−5 photon/e

Optical Corsstalk❏ Crosstalk

• Simulation Study(A. Nepomuk Otte)

• ( dominant )

• ( )

• diffusion

❏ Tranch

Rate 1/R2

10–20%

A. Ingargiola

Optical Corsstalk (R. Mirzoyan)

❏ Optical Crosstalk

• Optical Seperator (Trench)

• 2nd pn junction

❏ Afterpulse

• Recovery (∼ 1µsec)

• τAP 100 ns

OC SiPM ( MEPhi)

100 p.e. 101 p.e.

SPAD (S. Tudisco, F. Guerrieri, A. Ingargiola)

❏ Single Photon Avalanche Diode

• INFN/ST-Microelectronics

• Politecnico di Milano

❏ Active Quenching

❏ pixel

❏ Row(Anode) × Column(Cathod)

10×10 SPAD Array

.

SiMPl (J. Ninkovic) SiMPI ?

❏ Polysilicon

•

• Polysilicon

❏ thinning (∼ 70µm)

SiMPl (J. Ninkovic)

❏

• ( )

• FF

• Hopefully Radhard ?

❏

•

• Handle Wafer Bonding

❏ MPI

• 30×30 or 10×10 array

Avalanche CCD (G. Lutz)

❏ pnCCD avalanche

• Jet Chamber? Analogy

❏

• 51 × 51µm unit pixel

• 264×(256+256) pixels 18×30mm2

• 132 × (60 + 60) pixels 9 × 9 mm2

.

SiPM Array

❏ PET

❏ 3 × 3mm2 – 4 × 4mm2

Rad. Monitering Devices1.5mm×1.5mm×4

(C.J. Staples)

• Back-thinned CMOS

• back illu.

FBK-irst1mm×1mm×16

(N. Dinu)

• Italy

Photonique2.1mm×2.1mm×4

(D. McNally)

• CPTA

• Trench ( )

• p+ p n

.

SiPM ASIC (C. de La Taille/Orsay)

❏ Silicon Pm Integrated ReadOut Chip

• Developped for ILC Calorimeter

• 36ch input

• Energy Measurement

⋄ 2 gain × 12 bit Wilkinson ADC⋄ Variable Shaping 50ns–100ns⋄ 10 bit gain adjustable preamps

• Timing Measurement

⋄ 12 bit TDC 50 ns⋄ 4bit threshold adjustment

• 16 deep analog memory

• pulsed power mode

❏ MAROC/HARDROC

❏ available

❏ http://omega.in2p3.fr/

.

Axial PET (E. Bolle)❏ PET detector Geometry

• Z Crystal (φ )

• φ WLS (Z )

• r( ) segment

❏ Advantage

• error

• channel

Geometry

Axial PET (E. Bolle)

❏ Demo

• LYSO

⋄ Saint-Gobain PreLude 420⋄ 3 × 3 × 100 mm3

• WLS

⋄ Eljin Technology⋄ 0.9 × 3 × 40 mm3

• Photodetector

⋄ HPKMPPC⋄ 3 × 3 mm2 for LYSO⋄ 1.19 × 3.22 mm2 for WLS

❏ Test

• LYSO 12%(FWHM) Resolution

• WLS 73 p.e.

❏ Demo 2

Demonstrator

Test

.

Color Sensitive CMOS Detector (G. Langfelder)

❏

❏ TFD (Transverse Field Detector)

❏ Foveon

❏ 3 or 4

❏ 5–6 µm Pixel size

❏ V0,V1,V2 = 1.0, 2.1, 2.3 V

❏ upto 60% fill factor in future

Color Sensitive CMOS Detector (G. Langfelder)