1Publication date: July 2009 SME00002CEC

DATA SHEET

Part No.

Package Code No.

MN39901PLWQFN044-C-1212A

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MN39901PL

2SME00002CEC

ContentsOverview ……………………………………………………….…………………………………………………… 3

Features ……………………………………………………….……………………………………………………. 3

Applications …………………………………………………………………………………………………………. 3

Package …………………………………………………………………………………………………………….. 3

Application Circuit Example ………………………………………………………………………………………. 4

Pin Assignments ……………………………………………….…………………………………………………... 5

Pin Descriptions …………………………………………………………………………………………………… 6

Device Parameter ………………………………………………………………………………………………….. 7

Imaging Characteristics …………………………………………………………………………………………… 7

Absolute Maximum Ratings / Operating Voltage Conditions ……………………………................................ 8

Power Supply Currents …………………………………………………………………………………………… 9

Temperature Ratings ………………………………………………………………………………………………. 9

Spectral Characteristics …………………………………………………………………………………………… 9

Technical Data …………………………………………………………………………………………………….. 10

1/3.6 Inch 750H Timing …………………………………………………………………………………………. 10

1/3.6 Inch 750H Timing (Close-up A) …………………………………………………………………………... 13

1/3.6 Inch 750H Timing (Close-up B) …………………………………………………………………………… 14

Package Dimensions ……………………………………………………………………………………………… 15

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MN39901PL

3SME00002CEC

MN39901PLMOS Image Sensor

OverviewThe MN39901PL (ν Maicovicon®) is a 4.9 mm (Type 1/3.6) 37 k-pixel MOS image sensor that is most suitable for security

cameras and IP cameras. Excellent color reproducibility has been realized by applying the RGB Bayer pattern primary color on-chip filter.

Furthermore, the MN39901PL allows high sensitive and low noise shooting with a pixel dimension of 5.6 μm.And well, this device has a total of 410 800pixels (790 horizontally × 520 vertically) and provides clear and stable images.

FeaturesType-1/3.6 inch panorama VGA 0.37 mega pixel MOS image sensorEffective pixels: 738(H) × 480(V)Unit pixel size: 5.6 μm × 5.6 μm

ApplicationsIP camera (Network camera)Monitoring camera

PackageSmall type LCC 44Pin

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MN39901PL

4SME00002CEC

Application Circuit Example

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MN39901PL

5SME00002CEC

Pin Assignments

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MN39901PL

6SME00002CEC

Pin Descriptions

Digital groundInputDGND15

HSR (horizontal shift resister) clock pulse 2InputH214

HSR (horizontal shift resister) clock pulse 1InputH113

Noise cancellation clamp pulseInputNCCL12

Noise cancellation sample hold pulseInputNCSH11

HSR (horizontal shift resister) start pulseInputHST10

Horizontal signal line reset pulseInputSIGRS9

——N.C.8

Horizontal common signal line clamp voltageInputCLDCNC7

——N.C.6

——N.C.5

——N.C.4

Analog power supplyInputAVDD3

Analog signal outputOutputAMPOUT2

Analog groundInputAGND1

VSR (vertical shift resister) clock pulse 2InputV234

VSR (vertical shift resister) clock pulse 1InputV133

Pixel read-out pulseInputTRANS32

Pixel reset pulseInputRSCELL31

Multiplexer driving pulseInputVDRRS30

Multiplexer down pulseInputMXTR29

Digital groundInputDGND28

——N.C.27

Electronic shutter VSR (vertical shift resister) clock pulse 2 InputEV226

Electronic shutter VSR (vertical shift resister) clock pulse 1InputEV125

Digital power supplyInputDVDD24

——N.C.23

——N.C.22

——N.C.21

——N.C.20

——N.C.19

——N.C.18

Black crushed suppress circuit bias voltageInputBWJDG117

Digital power supplyInputDVDD16

DescriptionI/OPin namePin No.

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MN39901PL

7SME00002CEC

Pin Descriptions (continued)

——N.C.44

Analog groundInputAGND43

Digital groundInputDGND42

Pixel SF current supply pulseInputLOADCELL41

Power supply (VSR)InputDVDD40

Pixel power supply pulseInputVDDCELL39

Electronic shutter pixel reset pulseInputERSCELL38

Electronic shutter pixel readout pulseInputETRANS37

Electronic shutter VSR (vertical shift resister) start pulseInputSHT36

VSR (vertical shift resister) start pulseInputVST35

DescriptionI/OPin namePin No.

Device Parameter

μm24.133(H) × 2.688(V)Valid imaging area size

μm25.6(H) × 5.6(V)Pixel size

pixels738(H) × 480(V) = 354 240Valid pixels

pixels750(H) × 500(V) = 375 000Effective pixels(including transient ones)

pixels790(H) × 520(V) = 410 800Number of pixels

UnitValueParameter

Imaging Characteristics

275.0

758.0

Min

Standard illuminance

Saturation illuminance

Condition

300.0

900.0

Typ

mV—Sensitivity (G)

mV—Saturation output

UnitMaxParameter

<Definition of the “standard imaging condition">PKG conditionStandard exposure means the state using halogen bulb (color temperature 3200K), inserting an IR cut filter (CM500S, t = 2.5 mm) in the optical path, and having the sensor surface illuminated at 8.792 lx (Lens iris; F8). This is the definition of the standard imaging condition in this document. The standard exposure is defined as the sensor surface illuminance at this time.

Test conditions1. During measurement, apply the typical operating voltages for both the bias voltage conditions and clock voltage conditions as the sensor drive

conditions.2. Unless otherwise specified, the specifications show characteristics for an integration time of 1/30 seconds. (SIGRS clock: 18 MHz)

Unless otherwise specified, the test temperature is 60 °C.

Test Procedures1. Saturation Output

In the standard imaging condition, illuminance the sensor at 32 times the standard exposure and measure the sensor output signal voltage. The saturation output is determined from the formula below.

Saturation output (mV) = (average output in the test area) – (average output in the OB area)2. Sensitivity

In the standard imaging condition, measure the sensor output signal output voltage. The sensitivity is determined from the formula below.

Sensitivity (mV) = (average output for each color in the measurement area) – (average output in the OB area)

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MN39901PL

8SME00002CEC

Absolute Maximum Ratings / Operating Voltage Conditions

V0.20– 0.2—– 0.3LV5.25.04.85.3—H

ETRANS

V0.20– 0.2—– 0.3LV5.25.04.87—H

MXTR

V5.25.04.85.3—HEV1, EV2

V0.20– 0.2—– 0.3L

V2.22.01.8—– 0.3LV5.25.04.87—H

VDDCELL

V0.20– 0.2—– 0.3LV5.25.04.85.3—H

V1, V2

V0.20– 0.2—– 0.3LV5.25.04.87—H

VDRRS

V0.20– 0.2—– 0.3LV5.25.04.87—H

LOADCELL

V0.20– 0.2—– 0.3LV5.25.04.87—H

NCCL

V0.20– 0.2—– 0.3LV5.25.04.87—H

NCSH

V00– 0.2—– 0.3LV5.25.04.85.3—H

TRANS

V0.20– 0.2—– 0.3LV5.25.04.85.3—H

RSCELL

V0.20– 0.2—– 0.3LV5.25.04.85.3—H

H1, H2

V0.20– 0.2—– 0.3LV5.25.04.85.3—H

HST

V0.20– 0.2—– 0.3LV5.25.04.85.3—H

VST, SHT

V0.20– 0.2—– 0.3LV5.25.04.87—H

SIGRS

Operating voltage conditions

MaxTypMinMaxMin

– 0.3—

—GND

– 0.3– 0.3

Absolute maximum ratings

—5.3

—

4.07.0

– 0.24.8

—2.94.8

05.0

2.50

3.05.0

0.25.2

—3.15.2 VVDD(DVDD, AVDD)

VHERSCELL

*1VBWJDG1VDGND, AGND

NoteUnitPin name

VL

VCLDCNC

<VDDCELL>

H

LGND

<Pulse other than VDCEL>H

L(GND)

Note) *1: Fixed to 0 V externally when the suppression circuit for high luminance black spot is off.

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MN39901PL

9SME00002CEC

Power Supply Currents

Note) Temperature ratings are defined on package back side.

MaxTypMin

—

—

2

15

4

30 mAAVDD Current

NotesUnitParameter

mADVDD Current

MaxTypMin

–10

–30

–20

25

25

25

60

85

75 °COperating Temperature

°CPerformance Guarantee Temperature

NotesUnitParameter

°CStorage temperature

Temperature Ratings

Spectral Characteristics

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MN39901PL

10SME00002CEC

Technical Data1/3.6 Inch 750H Timing

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MN39901PL

11SME00002CEC

Technical Data (continued)1/3.6 Inch 750H Timing (continued)

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MN39901PL

12SME00002CEC

Technical Data (continued)1/3.6 Inch 750H Timing (continued)

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MN39901PL

13SME00002CEC

Technical Data (continued)1/3.6 Inch 750H Timing (Close-up A)

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MN39901PL

14SME00002CEC

Technical Data (continued)1/3.6 Inch 750H Timing (Close-up B)

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MN39901PL

15SME00002CEC

Package Dimensions (Unit: mm)WQFN044-C-1212A

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Request for your special attention and precautions in using the technical information andsemiconductors described in this book

(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book.

(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications:� Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support

systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-ucts may directly jeopardize life or harm the human body.� Any applications other than the standard applications intended.

(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.

(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

20080805

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